Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9905491 | Interposer substrate designs for semiconductor packages | In Sang Yoon, DeokKyung Yang | 2018-02-27 |
| 9748203 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | DeokKyung Yang, In Sang Yoon, Kyunghwan KIM | 2017-08-29 |
| 9331007 | Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages | InSang Yoon, Flynn Carson, Il Kwon Shim | 2016-05-03 |
| 9184067 | Methods of mitigating defects for semiconductor packages | Kyunghwan KIM, DeokKyung Yang, KeoChang Lee | 2015-11-10 |
| 8779562 | Integrated circuit packaging system with interposer shield and method of manufacture thereof | Seongmin Lee, Sungmin Song | 2014-07-15 |
| 8643181 | Integrated circuit packaging system with encapsulation and method of manufacture thereof | JoHyun Bae, SeungYun Ahn | 2014-02-04 |
| 8378476 | Integrated circuit packaging system with stacking option and method of manufacture thereof | Seongmin Lee, Byung Joon Han | 2013-02-19 |