SeongHun Mun — 7 Patents at Stats Chippac

SeongHun Mun has been granted 7 US patents while listed as an inventor at Stats Chippac. The first was granted in 2013 and the most recent in February 2018. SeongHun Mun ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list SeongHun Mun in Seojong-myeon, KR.

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date
9905491	Interposer substrate designs for semiconductor packages	In Sang Yoon, DeokKyung Yang	2018-02-27
9748203	Integrated circuit packaging system with conductive pillars and method of manufacture thereof	DeokKyung Yang, In Sang Yoon, Kyunghwan KIM	2017-08-29
9331007	Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages	InSang Yoon, Flynn Carson, Il Kwon Shim	2016-05-03
9184067	Methods of mitigating defects for semiconductor packages	Kyunghwan KIM, DeokKyung Yang, KeoChang Lee	2015-11-10
8779562	Integrated circuit packaging system with interposer shield and method of manufacture thereof	Seongmin Lee, Sungmin Song	2014-07-15
8643181	Integrated circuit packaging system with encapsulation and method of manufacture thereof	JoHyun Bae, SeungYun Ahn	2014-02-04
8378476	Integrated circuit packaging system with stacking option and method of manufacture thereof	Seongmin Lee, Byung Joon Han	2013-02-19

SeongHun Mun — 7 Patents

Issued Patents All Time

Patent Widget