Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9330945 | Integrated circuit package system with multi-chip module | Sungmin Song, JoHyun Bae, Jong-Woo Ha | 2016-05-03 |
| 9093391 | Integrated circuit packaging system with fan-in package and method of manufacture thereof | JoHyun Bae, Sangjin Lee | 2015-07-28 |
| 8643181 | Integrated circuit packaging system with encapsulation and method of manufacture thereof | JoHyun Bae, SeongHun Mun | 2014-02-04 |
| 8609463 | Integrated circuit package system employing multi-package module techniques | WonJun Ko, DongSoo Moon | 2013-12-17 |
| 8535981 | Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof | Chan Hoon Ko | 2013-09-17 |
| 8501535 | Integrated circuit package system with dual side connection and method for manufacturing thereof | Sungmin Song, JoHyun Bae | 2013-08-06 |
| 8258008 | Package-on-package system with via z-interconnections and method for manufacturing thereof | Taewoo Lee, Sang Ho Lee | 2012-09-04 |
| 8221583 | System for peeling semiconductor chips from tape | Gab Yong Min, Dong Hyong Lee, Jung Ho Kim | 2012-07-17 |
| 8067306 | Integrated circuit packaging system with exposed conductor and method of manufacture thereof | DeokKyung Yang | 2011-11-29 |
| 7884457 | Integrated circuit package system with dual side connection | Sungmin Song, JoHyun Bae | 2011-02-08 |
| 7863755 | Package-on-package system with via Z-interconnections | Taewoo Lee, Sang Ho Lee | 2011-01-04 |
| 7521297 | Multichip package system | Seongmin Lee, Koo Hong Lee | 2009-04-21 |