Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9435547 | Indoor device for an air conditioner | Yungkoo Lee, Jungwoo Lee, Jaehyuk Jung, Geunho Jin, Kidong Kim | 2016-09-06 |
| 9395124 | Indoor device for an air conditioner | Kidong Kim, Yungkoo Lee, Jungwoo Lee | 2016-07-19 |
| 9324659 | Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die | SungWon Cho, DaeSik Choi, HyungSang Park | 2016-04-26 |
| 9228591 | Air conditioner with outdoor unit | Seok Ho Choi | 2016-01-05 |
| 9093392 | Integrated circuit packaging system with vertical interconnection and method of manufacture thereof | SungWon Cho, JoHyun Bae, DaeSik Choi | 2015-07-28 |
| 9021829 | Outdoor unit for air conditioner | Mijin Jung, Samchul Ha | 2015-05-05 |
| 8884339 | Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process | KiYoun Jang, DaeSik Choi, OhHan Kim | 2014-11-11 |
| 8785251 | Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die | SooMoon Park, Byoungwook Jang | 2014-07-22 |
| 8692365 | Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof | Taewoo Lee, Soo-San Park, SooMoon Park, Sang Ho Lee | 2014-04-08 |
| 8609463 | Integrated circuit package system employing multi-package module techniques | WonJun Ko, SeungYun Ahn | 2013-12-17 |
| 8569895 | Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die | SooMoon Park, Byoungwook Jang | 2013-10-29 |
| 8519536 | Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process | KiYoun Jang, DaeSik Choi, OhHan Kim | 2013-08-27 |
| 8513057 | Integrated circuit packaging system with routable underlayer and method of manufacture thereof | Oh Han Kim, Ki Youn Jang, DaeSik Choi | 2013-08-20 |
| 8367467 | Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process | KiYoun Jang, DaeSik Choi, OhHan Kim | 2013-02-05 |
| 8211746 | Integrated circuit packaging system with lead frame and method of manufacture thereof | Jong-Woo Ha, TaeWoo Kang | 2012-07-03 |
| 8193036 | Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die | SooMoon Park, Byoungwook Jang | 2012-06-05 |
| 8115293 | Integrated circuit packaging system with interconnect and method of manufacture thereof | Taewoo Lee, Soo-San Park, SooMoon Park, Sang Ho Lee | 2012-02-14 |
| 7968373 | Integrated circuit package on package system | Jong-Woo Ha, Joosang Kim | 2011-06-28 |
| 7951643 | Integrated circuit packaging system with lead frame and method of manufacture thereof | Jong-Woo Ha, TaeWoo Kang | 2011-05-31 |
| 7919871 | Integrated circuit package system for stackable devices | Sungmin Song | 2011-04-05 |