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Indoor device for an air conditioner |
Yungkoo Lee, Jungwoo Lee, Jaehyuk Jung, Geunho Jin, Kidong Kim |
2016-09-06 |
| 9395124 |
Indoor device for an air conditioner |
Kidong Kim, Yungkoo Lee, Jungwoo Lee |
2016-07-19 |
| 9324659 |
Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die |
SungWon Cho, DaeSik Choi, HyungSang Park |
2016-04-26 |
| 9228591 |
Air conditioner with outdoor unit |
Seok Ho Choi |
2016-01-05 |
| 9093392 |
Integrated circuit packaging system with vertical interconnection and method of manufacture thereof |
SungWon Cho, JoHyun Bae, DaeSik Choi |
2015-07-28 |
| 9021829 |
Outdoor unit for air conditioner |
Mijin Jung, Samchul Ha |
2015-05-05 |
| 8884339 |
Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process |
KiYoun Jang, DaeSik Choi, OhHan Kim |
2014-11-11 |
| 8785251 |
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die |
SooMoon Park, Byoungwook Jang |
2014-07-22 |
| 8692365 |
Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof |
Taewoo Lee, Soo-San Park, SooMoon Park, Sang Ho Lee |
2014-04-08 |
| 8609463 |
Integrated circuit package system employing multi-package module techniques |
WonJun Ko, SeungYun Ahn |
2013-12-17 |
| 8569895 |
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die |
SooMoon Park, Byoungwook Jang |
2013-10-29 |
| 8519536 |
Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process |
KiYoun Jang, DaeSik Choi, OhHan Kim |
2013-08-27 |
| 8513057 |
Integrated circuit packaging system with routable underlayer and method of manufacture thereof |
Oh Han Kim, Ki Youn Jang, DaeSik Choi |
2013-08-20 |
| 8367467 |
Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process |
KiYoun Jang, DaeSik Choi, OhHan Kim |
2013-02-05 |
| 8211746 |
Integrated circuit packaging system with lead frame and method of manufacture thereof |
Jong-Woo Ha, TaeWoo Kang |
2012-07-03 |
| 8193036 |
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die |
SooMoon Park, Byoungwook Jang |
2012-06-05 |
| 8115293 |
Integrated circuit packaging system with interconnect and method of manufacture thereof |
Taewoo Lee, Soo-San Park, SooMoon Park, Sang Ho Lee |
2012-02-14 |
| 7968373 |
Integrated circuit package on package system |
Jong-Woo Ha, Joosang Kim |
2011-06-28 |
| 7951643 |
Integrated circuit packaging system with lead frame and method of manufacture thereof |
Jong-Woo Ha, TaeWoo Kang |
2011-05-31 |
| 7919871 |
Integrated circuit package system for stackable devices |
Sungmin Song |
2011-04-05 |
