Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334578 | Electronic device including battery | Sukhyun LEE, Sunjin KIM, Yongsub JEON, Chihyun Cho, Jaeman Choi +1 more | 2025-06-17 |
| 12287684 | Electronic device including heat transfer member | Gisoo LIM, Changryong HEO, Gilho KIM, Juho SONG, Kwanghoon Choi | 2025-04-29 |
| 11990786 | Electronic device and method for controlling cooling function of external electronic device | Chihwan Jeong, Kyungha Koo, Se Young Jang, Han-Shil Choi | 2024-05-21 |
| 11695291 | Method to charge battery and electronic device including battery | Myeongho Kim, Shihyun KIM, Inhye Kim, Chaisung Ryu | 2023-07-04 |
| 10785887 | Electronic device including cooling function and controlling method thereof | Chihwan Jeong, Kyungha Koo, Se Young Jang, Han-Shil Choi | 2020-09-22 |
| 10680470 | Electronic device having wireless power transmitting/receiving conductive pattern | Chulwoo Park, Hyundeok Seo, Se Young Jang, Chi-Hyun Cho | 2020-06-09 |
| 10158261 | Electronic device having wireless power transmitting/receiving conductive pattern | Chulwoo Park, Hyundeok Seo, Se Young Jang, Chi-Hyun Cho | 2018-12-18 |
| 10096540 | Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance | KyungHoon Lee, SeongWon Park, Jaehyun Lee | 2018-10-09 |
| 9460972 | Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection | SeongWon Park, KyungHoon Lee, Jaehyun Lee | 2016-10-04 |
| 9236332 | Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe | Reza A. Pagaila, HunTeak Lee | 2016-01-12 |
| 9230933 | Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure | Jaehyun Lee, KyungHoon Lee, SeongWon Park | 2016-01-05 |
| 9117812 | Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability | Jaehyun Lee, KyungHoon Lee, Taewoo Lee | 2015-08-25 |
| 9054100 | Semiconductor die and method of forming sloped surface in photoresist layer to enhance flow of underfill material between semiconductor die and substrate | Jaehyun Lee | 2015-06-09 |
| 9030030 | Semiconductor device and method of forming adjacent channel and dam material around die attach area of substrate to control outward flow of underfill material | KyungHoon Lee, Joondong Kim | 2015-05-12 |
| 8896133 | Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate | SungWon Cho, YongHee Kang, Hyung Sang Park | 2014-11-25 |
| 8884339 | Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process | DaeSik Choi, OhHan Kim, DongSoo Moon | 2014-11-11 |
| 8742566 | Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers | Sungsoo Kim, YongHee Kang | 2014-06-03 |
| 8642384 | Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability | Jaehyun Lee, KyungHoon Lee, Taewoo Lee | 2014-02-04 |
| 8563418 | Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces | Reza A. Pagaila, HunTeak Lee | 2013-10-22 |
| 8519536 | Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process | DaeSik Choi, OhHan Kim, DongSoo Moon | 2013-08-27 |
| 8492197 | Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate | SungWon Cho, YongHee Kang, Hyung Sang Park | 2013-07-23 |
| 8409978 | Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe | Reza A. Pagaila, HunTeak Lee | 2013-04-02 |
| 8399300 | Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material | KyungHoon Lee, Joondong Kim | 2013-03-19 |
| 8389398 | Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers | Sungsoo Kim, YongHee Kang | 2013-03-05 |
| 8367467 | Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process | DaeSik Choi, OhHan Kim, DongSoo Moon | 2013-02-05 |