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Solvent-free curable composition, cured film produced using same composition, color filter comprising same cured film, and display device |
Onyou PARK, Kyunghee KANG, Jonggi KIM, Bumjin LEE, Minjee PARK +3 more |
2025-09-09 |
| 12412960 |
Porous separator and lithium secondary battery comprising same |
Woongchul Choi, Junghun Choi, Minchul Jang, Suk Il Youn, Byoungkuk Son |
2025-09-09 |
| 12365833 |
Curable composition, cured film produced using same, and color filter comprising same |
Jonggi KIM, Onyou PARK, Bumjin LEE |
2025-07-22 |
| 12351750 |
Quantum dot, curable composition comprising the same, cured layer using the composition, and color filter including the cured layer |
Jonggi KIM, Jihyeon YIM, Dongjun Kim, Misun KIM, Minjee PARK +3 more |
2025-07-08 |
| 12331234 |
Quantum dot, curable composition comprising the same, cured layer using the composition, color filter including the cured layer, display device including the cured layer and method of manufacturing the cured layer |
Jonggi KIM, Dongjun Kim, Misun KIM, Minjee PARK, Bumjin LEE +2 more |
2025-06-17 |
| 12312521 |
Non-solvent type curable composition, cured layer using the same, color filter including the cured layer, display device including the cured layer and manufacturing method of the cured layer |
Mi Jeong CHOI, Dongjun Kim, Misun KIM, Jonggi KIM, Minjee PARK +2 more |
2025-05-27 |
| 12308427 |
Irreversible additive comprised in cathode material for secondary battery, cathode material comprising the same, and secondary battery comprising cathode material |
Sung Chul Lim, Minchul Jang, Insung Uhm, Junghun Choi, Hee Chang Youn |
2025-05-20 |
| 12002990 |
Porous separator and lithium secondary battery comprising same |
Woongchul Choi, Junghun Choi, Minchul Jang, Suk Il Youn, Byoungkuk Son |
2024-06-04 |
| 11912911 |
Quantum dot, curable composition comprising the same, cured layer using the composition and color filter including the cured layer |
Jonggi KIM, Jihyeon YIM, Dongjun Kim, Misun KIM, Minjee PARK +3 more |
2024-02-27 |
| 11866624 |
Non-solvent type curable composition, cured layer using the same, color filter including the cured layer, display device including the cured layer and manufacturing method of the cured layer |
Mi Jeong CHOI, Dongjun Kim, Misun KIM, Jonggi KIM, Minjee PARK +2 more |
2024-01-09 |
| 11866625 |
Curable composition, cured layer using the same, and display device including cured layer |
Injae Lee, Jonggi KIM, Minjee PARK, Dongjun Kim, Bumjin LEE +1 more |
2024-01-09 |
| 11762289 |
Composition including quantum dot, manufacturing method quantum dot and color filter |
Jinsuop YOUN, Misun KIM, Hong Jeong YU, Bumjin LEE, Dongjun Kim +8 more |
2023-09-19 |
| 11760926 |
Quantum dot, curable composition comprising the same, cured layer using the composition, color filter including the cured layer, and display device including the cured layer |
Jonggi KIM, Dongjun Kim, Misun KIM, Minjee PARK, Bumjin LEE +2 more |
2023-09-19 |
| 10915020 |
Photosensitive resin composition, photosensitive resin layer using same and color filter |
Jiyoung JEONG, Bumjin LEE, Misun KIM, Jonggi KIM, Onyou PARK +9 more |
2021-02-09 |
| 9524958 |
Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding |
JoonYoung Choi, HunTeak Lee, KeonTaek Kang, YoungChul Kim |
2016-12-20 |
| 8994048 |
Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration |
JoonYoung Choi |
2015-03-31 |
| 8896133 |
Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate |
SungWon Cho, KiYoun Jang, Hyung Sang Park |
2014-11-25 |
| 8786076 |
Semiconductor device and method of forming a thermally reinforced semiconductor die |
OhHan Kim, KyungHoon Lee |
2014-07-22 |
| 8742566 |
Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers |
KiYoun Jang, Sungsoo Kim |
2014-06-03 |
| 8492197 |
Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate |
SungWon Cho, KiYoun Jang, Hyung Sang Park |
2013-07-23 |
| 8389398 |
Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers |
KiYoun Jang, Sungsoo Kim |
2013-03-05 |
| 8169071 |
Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers |
KiYoun Jang, Sungsoo Kim |
2012-05-01 |
| 7897502 |
Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers |
KiYoun Jang, Sungsoo Kim |
2011-03-01 |
| 7851345 |
Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding |
Seongbo Shim, KyungOe Kim |
2010-12-14 |
