Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218114 | Semiconductor device and method of making a photonic semiconductor package | Youngcheol Kim, HeeSoo Lee | 2025-02-04 |
| 12107028 | Thermally enhanced FCBGA package | Wagno Alves Braganca, JR., DongSam Park | 2024-10-01 |
| 12074135 | Semiconductor device and method of controlling warpage during LAB | Wagno Alves Braganca, JR. | 2024-08-27 |
| 11929334 | Die-beam alignment for laser-assisted bonding | Wagno Alves Braganca, JR., TaeKeun Lee | 2024-03-12 |
| 11823973 | Package with compartmentalized lid for heat spreader and EMI shield | DongSam Park, Woojin Lee | 2023-11-21 |
| 11817357 | Region-of-interest positioning for laser-assisted bonding | Wagno Alves Braganca, JR. | 2023-11-14 |
| 11688718 | Semiconductor device and method of controlling warpage during LAB | Wagno Alves Braganca, JR. | 2023-06-27 |
| 11670563 | Thermally enhanced FCBGA package | Wagno Alves Braganca, JR., DongSam Park | 2023-06-06 |
| 10109587 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan +3 more | 2018-10-23 |
| 9773685 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, TaeWoo Kang | 2017-09-26 |
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan +3 more | 2016-08-09 |
| 9373573 | Solder joint flip chip interconnection | Rajendra D. Pendse, TaeWoo Kang | 2016-06-21 |
| 9093278 | Method of manufacture of integrated circuit packaging system with plasma processing | JoonYoung Choi, Seong Won Park, Hun Teak Lee, SungWon Cho | 2015-07-28 |
| 8859342 | Integrated circuit packaging system with substrate mold gate and method of manufacture thereof | Oh Han Kim, Haengcheol Choi | 2014-10-14 |
| 8810029 | Solder joint flip chip interconnection | Rajendra D. Pendse, TaeWoo Kang | 2014-08-19 |
| RE44761 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, TaeWoo Kang | 2014-02-11 |
| RE44608 | Solder joint flip chip interconnection | Rajendra D. Pendse, TaeWoo Kang | 2013-11-26 |
| RE44562 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, TaeWoo Kang | 2013-10-29 |
| 8288205 | Package in package system incorporating an internal stiffener component | Seong Bo Shim, Yong Hee Kang | 2012-10-16 |
| 8216930 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, TaeWoo Kang | 2012-07-10 |
| 8129841 | Solder joint flip chip interconnection | Rajendra D. Pendse, TaeWoo Kang | 2012-03-06 |
| 8124520 | Integrated circuit mount system with solder mask pad | Haengcheol Choi, Kyung-Moon Kim, Rajendra D. Pendse | 2012-02-28 |
| 8115301 | Methods for manufacturing thermally enhanced flip-chip ball grid arrays | Youngjoon KIM, Hyunsoo Shin | 2012-02-14 |
| 8018052 | Integrated circuit package system with side substrate having a top layer | TaeWoo Kang, HyunSu Shin | 2011-09-13 |
| 7851345 | Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding | Seongbo Shim, YongHee Kang | 2010-12-14 |