Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10691016 | Methods of forming semiconductors using etching effect predictions and methods for determining input parameters for semiconductor formation | — | 2020-06-23 |
| 9706652 | Printed circuit board and method for manufacturing same | Sung Wuk Ryu, Seung Yul Shin | 2017-07-11 |
| 9418913 | Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding | Kyung Oe Kim, Yong Hee Kang | 2016-08-16 |
| 9363883 | Printed circuit board and method for manufacturing same | Sung Wuk Ryu, Seung Yul Shin | 2016-06-07 |
| 8860953 | Method and apparatus for measuring overlay | Jeong-Ho Yeo, Ho Yeon Kim | 2014-10-14 |
| 8779570 | Stackable integrated circuit package system | TaeWoo Kang, Yong Hee Kang | 2014-07-15 |
| 8762901 | Method for process proximity correction | Wonchan Lee, Sunghoon JANG, Gun Huh | 2014-06-24 |
| 8614034 | Method of manufacturing photo-mask | Seong Ho Moon, Artem Shamsuarov, Seung-hune Yang | 2013-12-24 |
| 8392854 | Method of manufacturing semiconductor device by using uniform optical proximity correction | Sang-wook Kim, Chun-Suk Suh, Seong-woon Choi, Jung Hoon SER, Moon-Gyu Jeong | 2013-03-05 |
| 8355139 | Semiconductor apparatus including alignment tool | — | 2013-01-15 |
| 8349721 | Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding | Kyung Oe Kim, Yong Hee Kang | 2013-01-08 |
| 8288205 | Package in package system incorporating an internal stiffener component | KyungOe Kim, Yong Hee Kang | 2012-10-16 |