Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12213253 | Printed circuit board | Seung Yul Shin, Joon Wook Han | 2025-01-28 |
| 12160955 | Circuit board | Dong Sun Kim, Sang Hyuck NAM | 2024-12-03 |
| 12089325 | Printed circuit board | Jae-Hwa Kim, Seung Yul Shin | 2024-09-10 |
| 12089329 | Printed circuit board comprising via portions | Seung Yul Shin, Joon Wook Han | 2024-09-10 |
| 10134679 | Printed circuit board, package substrate comprising same, and method for manufacturing same | Dong Sun Kim, Ji Haeng Lee | 2018-11-20 |
| 10062623 | Semiconductor package substrate, package system using the same and method for manufacturing thereof | Dong Sun Kim, Seung Yul Shin | 2018-08-28 |
| 9867296 | Printed circuit board and package substrate | Dong Sun Kim, Hyun Seok Seo, Ji Haeng Lee | 2018-01-09 |
| 9748192 | Printed circuit board having a post bump | Ji Haeng Lee, Dong Sun Kim | 2017-08-29 |
| 9706652 | Printed circuit board and method for manufacturing same | Seong Bo Shim, Seung Yul Shin | 2017-07-11 |
| 9589878 | Semiconductor package | Dong Sun Kim, Hyun Seok Seo, Ji Haeng Lee | 2017-03-07 |
| 9466543 | Semiconductor package substrate, package system using the same and method for manufacturing thereof | Dong Sun Kim, Seung Yul Shin | 2016-10-11 |
| 9363883 | Printed circuit board and method for manufacturing same | Seong Bo Shim, Seung Yul Shin | 2016-06-07 |
| 9252112 | Semiconductor package | Dong Sun Kim, Ji Haeng Lee | 2016-02-02 |
| 8956919 | Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof | Hyun-Aee Chun, Jae Bong Choi, Sung Won Lee, Hyuk Lee, Sai Ran Eom | 2015-02-17 |
| 8659131 | Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut | Ji-Yun Kim, Hyun Sub Shin, Sung Won Lee, Hyung Eui Lee, Yeong Uk Seo +1 more | 2014-02-25 |