Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8659131 | Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut | Ji-Yun Kim, Sung Won Lee, Hyung Eui Lee, Yeong Uk Seo, Sung Wuk Ryu +1 more | 2014-02-25 |