HS

HyunSu Shin

SC Stats Chippac: 4 patents #148 of 425Top 35%
LG: 4 patents #9,134 of 26,165Top 35%
FI Fujifilm Business Innovation: 1 patents #3,579 of 5,238Top 70%
Overall (All Time): #561,201 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
11131873 Display apparatus with sound generation device Yoonmo Nam, YeongRak Choi, Sungsu Ham 2021-09-28
10841678 Sound generator and display apparatus YeongRak Choi, KwanHo Park, Sungtae Lee 2020-11-17
10698242 Display apparatus with sound generation device Yoonmo Nam, YeongRak Choi, Sungsu Ham 2020-06-30
10531171 Sound generator and display apparatus YeongRak Choi, KwanHo Park, Sungtae Lee 2020-01-07
9365374 Sheet transport device and image forming system Hajime Yoshii, Nooun Lee, Inho Kang, Taeil Byeon, Woojin Ha +2 more 2016-06-14
8932908 Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die KyuWon Lee, Hun Jeong, JinGwan Kim, SunYoung Chun 2015-01-13
8502392 Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die KyuWon Lee, Hun Jeong, JinGwan Kim, SunYoung Chun 2013-08-06
8288202 Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die KyuWon Lee, Hun Jeong, JinGwan Kim, SunYoung Chun 2012-10-16
8018052 Integrated circuit package system with side substrate having a top layer KyungOe Kim, TaeWoo Kang 2011-09-13