| 8932908 |
Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die |
KyuWon Lee, HyunSu Shin, Hun Jeong, JinGwan Kim |
2015-01-13 |
| 8502392 |
Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die |
KyuWon Lee, HyunSu Shin, Hun Jeong, JinGwan Kim |
2013-08-06 |
| 8432028 |
Integrated circuit packaging system with package-on-package and method of manufacture thereof |
JinGwan Kim, KyuWon Lee, MoonKi Jeong, JiHoon Oh |
2013-04-30 |
| 8288202 |
Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die |
KyuWon Lee, HyunSu Shin, Hun Jeong, JinGwan Kim |
2012-10-16 |
| 8004093 |
Integrated circuit package stacking system |
JiHoon Oh, JinGwan Kim, Jaehyun LIM, KyuWon Lee, SinJae Lee +1 more |
2011-08-23 |