Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8932908 | Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die | KyuWon Lee, HyunSu Shin, Hun Jeong, JinGwan Kim | 2015-01-13 |
| 8502392 | Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die | KyuWon Lee, HyunSu Shin, Hun Jeong, JinGwan Kim | 2013-08-06 |
| 8432028 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | JinGwan Kim, KyuWon Lee, MoonKi Jeong, JiHoon Oh | 2013-04-30 |
| 8288202 | Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die | KyuWon Lee, HyunSu Shin, Hun Jeong, JinGwan Kim | 2012-10-16 |
| 8004093 | Integrated circuit package stacking system | JiHoon Oh, JinGwan Kim, Jaehyun LIM, KyuWon Lee, SinJae Lee +1 more | 2011-08-23 |