SinJae Lee — 11 Patents at Stats Chippac

SinJae Lee has been granted 11 US patents while listed as an inventor at Stats Chippac. The first was granted in 2010 and the most recent in July 2016. SinJae Lee ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list SinJae Lee in Seojong-myeon, KR.

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Showing 1–11 of 11 patents

Patent #	Title	Co-Inventors	Date
9401347	Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV	JinGwan Kim, JiHoon Oh, Jaehyun LIM, KyuWon Lee	2016-07-26
9379064	Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die	JiHoon Oh, JinGwan Kim	2016-06-28
9048209	Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die	JiHoon Oh, JinGwan Kim	2015-06-02
8937371	Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV	JinGwan Kim, JiHoon Oh, Jaehyun LIM, KyuWon Lee	2015-01-20
8836114	Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers	JiHoon Oh, JinGwan Kim	2014-09-16
8569870	Integrated circuit packaging system with shielding spacer and method of manufacture thereof	JongVin Park, Sung Jun Yoon, JiHoon Oh	2013-10-29
8531012	Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV	JinGwan Kim, JiHoon Oh, Jaehyun LIM, KyuWon Lee	2013-09-10
8343810	Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers	JiHoon Oh, JinGwan Kim	2013-01-01
8003496	Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die	JiHoon Oh, JinGwan Kim	2011-08-23
8004093	Integrated circuit package stacking system	JiHoon Oh, JinGwan Kim, Jaehyun LIM, SunYoung Chun, KyuWon Lee +1 more	2011-08-23
7683469	Package-on-package system with heat spreader	JiHoon Oh, KyuWon Lee, Jaehyun LIM, JongVin Park	2010-03-23

SinJae Lee — 11 Patents

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