SL

SinJae Lee

SC Stats Chippac: 11 patents #91 of 425Top 25%
Overall (All Time): #462,339 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9401347 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV JinGwan Kim, JiHoon Oh, Jaehyun LIM, KyuWon Lee 2016-07-26
9379064 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die JiHoon Oh, JinGwan Kim 2016-06-28
9048209 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die JiHoon Oh, JinGwan Kim 2015-06-02
8937371 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV JinGwan Kim, JiHoon Oh, Jaehyun LIM, KyuWon Lee 2015-01-20
8836114 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers JiHoon Oh, JinGwan Kim 2014-09-16
8569870 Integrated circuit packaging system with shielding spacer and method of manufacture thereof JongVin Park, Sung Jun Yoon, JiHoon Oh 2013-10-29
8531012 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV JinGwan Kim, JiHoon Oh, Jaehyun LIM, KyuWon Lee 2013-09-10
8343810 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers JiHoon Oh, JinGwan Kim 2013-01-01
8003496 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die JiHoon Oh, JinGwan Kim 2011-08-23
8004093 Integrated circuit package stacking system JiHoon Oh, JinGwan Kim, Jaehyun LIM, SunYoung Chun, KyuWon Lee +1 more 2011-08-23
7683469 Package-on-package system with heat spreader JiHoon Oh, KyuWon Lee, Jaehyun LIM, JongVin Park 2010-03-23