Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401347 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | JinGwan Kim, JiHoon Oh, Jaehyun LIM, KyuWon Lee | 2016-07-26 |
| 9379064 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | JiHoon Oh, JinGwan Kim | 2016-06-28 |
| 9048209 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | JiHoon Oh, JinGwan Kim | 2015-06-02 |
| 8937371 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | JinGwan Kim, JiHoon Oh, Jaehyun LIM, KyuWon Lee | 2015-01-20 |
| 8836114 | Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers | JiHoon Oh, JinGwan Kim | 2014-09-16 |
| 8569870 | Integrated circuit packaging system with shielding spacer and method of manufacture thereof | JongVin Park, Sung Jun Yoon, JiHoon Oh | 2013-10-29 |
| 8531012 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | JinGwan Kim, JiHoon Oh, Jaehyun LIM, KyuWon Lee | 2013-09-10 |
| 8343810 | Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers | JiHoon Oh, JinGwan Kim | 2013-01-01 |
| 8003496 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | JiHoon Oh, JinGwan Kim | 2011-08-23 |
| 8004093 | Integrated circuit package stacking system | JiHoon Oh, JinGwan Kim, Jaehyun LIM, SunYoung Chun, KyuWon Lee +1 more | 2011-08-23 |
| 7683469 | Package-on-package system with heat spreader | JiHoon Oh, KyuWon Lee, Jaehyun LIM, JongVin Park | 2010-03-23 |