| 12211778 |
Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure |
Hermes T. Apale, Mark Sackett |
2025-01-28 |
| 11775729 |
Technology file process rule validation |
Phaniraj Joshi, Pilwon Kang, Youngrog Jo, Zameer Iqbal, Nitin Kishorkumar Ingole |
2023-10-03 |
| 11764136 |
Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure |
Hermes T. Apale, Mark Sackett |
2023-09-19 |
| 9401347 |
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV |
SinJae Lee, JinGwan Kim, JiHoon Oh, Jaehyun LIM |
2016-07-26 |
| 9082887 |
Integrated circuit packaging system with posts and method of manufacture thereof |
DaeSik Choi, Taewoo Lee, SungWon Cho |
2015-07-14 |
| 8937371 |
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV |
SinJae Lee, JinGwan Kim, JiHoon Oh, Jaehyun LIM |
2015-01-20 |
| 8932908 |
Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die |
HyunSu Shin, Hun Jeong, JinGwan Kim, SunYoung Chun |
2015-01-13 |
| 8574964 |
Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape |
SungWon Cho, Taewoo Lee, DaeSik Choi |
2013-11-05 |
| 8531012 |
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV |
SinJae Lee, JinGwan Kim, JiHoon Oh, Jaehyun LIM |
2013-09-10 |
| 8519544 |
Semiconductor device and method of forming WLCSP structure using protruded MLP |
OhHan Kim, SungWon Cho, DaeSik Choi, DongSoo Moo |
2013-08-27 |
| 8502387 |
Integrated circuit packaging system with vertical interconnection and method of manufacture thereof |
DaeSik Choi, Taewoo Lee, SungWon Cho |
2013-08-06 |
| 8502392 |
Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die |
HyunSu Shin, Hun Jeong, JinGwan Kim, SunYoung Chun |
2013-08-06 |
| 8432028 |
Integrated circuit packaging system with package-on-package and method of manufacture thereof |
JinGwan Kim, MoonKi Jeong, SunYoung Chun, JiHoon Oh |
2013-04-30 |
| 8310038 |
Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof |
JinGwan Kim, JiHoon Oh, JongVin Park |
2012-11-13 |
| 8288202 |
Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die |
HyunSu Shin, Hun Jeong, JinGwan Kim, SunYoung Chun |
2012-10-16 |
| 8273604 |
Semiconductor device and method of forming WLCSP structure using protruded MLP |
OhHan Kim, SungWon Cho, DaeSik Choi, DongSoo Moo |
2012-09-25 |
| 8004093 |
Integrated circuit package stacking system |
JiHoon Oh, JinGwan Kim, Jaehyun LIM, SunYoung Chun, SinJae Lee +1 more |
2011-08-23 |
| 7683469 |
Package-on-package system with heat spreader |
JiHoon Oh, Jaehyun LIM, JongVin Park, SinJae Lee |
2010-03-23 |
