DM

DongSoo Moo

SC Stats Chippac: 2 patents #228 of 425Top 55%
Overall (All Time): #2,077,204 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8519544 Semiconductor device and method of forming WLCSP structure using protruded MLP OhHan Kim, SungWon Cho, DaeSik Choi, KyuWon Lee 2013-08-27
8273604 Semiconductor device and method of forming WLCSP structure using protruded MLP OhHan Kim, SungWon Cho, DaeSik Choi, KyuWon Lee 2012-09-25