Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211778 | Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure | Hermes T. Apale, KyuWon Lee | 2025-01-28 |
| 11764136 | Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure | Hermes T. Apale, KyuWon Lee | 2023-09-19 |
| 8827095 | Expandable-collapsible safe | — | 2014-09-09 |
| 5471730 | Method for refurbishing worn turret punch press bores | — | 1995-12-05 |