Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211778 | Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure | KyuWon Lee, Mark Sackett | 2025-01-28 |
| 11764136 | Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure | KyuWon Lee, Mark Sackett | 2023-09-19 |
| 6960493 | Semiconductor device package | Virgil Ararao, Il Kwon Shim | 2005-11-01 |
| 6875634 | Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same | Il Kwon Shim, Weddie Aquien, Dario S. Filoteo, Jr., Virgil Ararao, Leo A. Merilo | 2005-04-05 |
| 6825067 | Mold cap anchoring method for molded flex BGA packages | Virgil Ararao, Il Kwon Shim | 2004-11-30 |
| 6818981 | Heat spreader interconnect for thermally enhanced PBGA packages | Il Kwon Shim, Gerry Balanon | 2004-11-16 |
| 6737298 | Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same | Il Kwon Shim, Weddle Aquien, Dario S. Filoteo, Jr., Virgil Ararao, Leo A. Merilo | 2004-05-18 |
| 6706563 | Heat spreader interconnect methodology for thermally enhanced PBGA packages | Il Kwon Shim, Gerry Balanon | 2004-03-16 |