Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7446408 | Semiconductor package with heat sink | Il Kwon Shim, Seng Guan Chow | 2008-11-04 |
| 6818981 | Heat spreader interconnect for thermally enhanced PBGA packages | Il Kwon Shim, Hermes T. Apale | 2004-11-16 |
| 6706563 | Heat spreader interconnect methodology for thermally enhanced PBGA packages | Il Kwon Shim, Hermes T. Apale | 2004-03-16 |
| 6599779 | PBGA substrate for anchoring heat sink | Il Kwon Shim, Seng Guan Chow | 2003-07-29 |
| 6534859 | Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package | Il Kwon Shim, Seng Guan Chow | 2003-03-18 |