Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11683963 | Anisotropic conductive film and display device using the same | Chungseok Lee, Donghee Park, Cheolgeun An, Euiyun Jang, Jeongho Hwang | 2023-06-20 |
| 11226696 | Display device | Myoung-Ha Jeon, Youngsoo Kim | 2022-01-18 |
| 10672853 | Flexible display apparatus | Seunghwa Ha, Euiyun Jang, Donghee Park | 2020-06-02 |
| 10217807 | Anisotropic conductive film and display device using the same | Chungseok Lee, Donghee Park, Cheolgeun An, Euiyun Jang, Jeongho Hwang | 2019-02-26 |
| 10088703 | Method of manufacturing display device | Changok Kim, Taeyoung Ahn, Sangwook Lee, Kiseong Seo, Junmo Im | 2018-10-02 |
| 10050227 | Display apparatus | Donghee Park, Cheolgeun An, Chungseok Lee, Euiyun Jang, Jeongho Hwang | 2018-08-14 |
| 9933655 | Polarizer and display device comprising the same | Taeyoung Ahn | 2018-04-03 |
| 9401347 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | SinJae Lee, JinGwan Kim, Jaehyun LIM, KyuWon Lee | 2016-07-26 |
| 9379064 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | SinJae Lee, JinGwan Kim | 2016-06-28 |
| 9196213 | Gate driving circuit and display device having the same | Cheolkyu Kim, Sanghyun Jeon | 2015-11-24 |
| 9048209 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | SinJae Lee, JinGwan Kim | 2015-06-02 |
| 8937371 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | SinJae Lee, JinGwan Kim, Jaehyun LIM, KyuWon Lee | 2015-01-20 |
| 8836114 | Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers | SinJae Lee, JinGwan Kim | 2014-09-16 |
| 8709932 | Integrated circuit packaging system with interconnects and method of manufacture thereof | Soo Won Lee, Sung Jun Yoon | 2014-04-29 |
| 8569870 | Integrated circuit packaging system with shielding spacer and method of manufacture thereof | SinJae Lee, JongVin Park, Sung Jun Yoon | 2013-10-29 |
| 8531012 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | SinJae Lee, JinGwan Kim, Jaehyun LIM, KyuWon Lee | 2013-09-10 |
| 8432028 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | JinGwan Kim, KyuWon Lee, MoonKi Jeong, SunYoung Chun | 2013-04-30 |
| 8343810 | Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers | SinJae Lee, JinGwan Kim | 2013-01-01 |
| 8310038 | Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof | JinGwan Kim, KyuWon Lee, JongVin Park | 2012-11-13 |
| 8003496 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | SinJae Lee, JinGwan Kim | 2011-08-23 |
| 8004093 | Integrated circuit package stacking system | JinGwan Kim, Jaehyun LIM, SunYoung Chun, KyuWon Lee, SinJae Lee +1 more | 2011-08-23 |
| 7683469 | Package-on-package system with heat spreader | KyuWon Lee, Jaehyun LIM, JongVin Park, SinJae Lee | 2010-03-23 |