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Anisotropic conductive film and display device using the same |
Chungseok Lee, Donghee Park, Cheolgeun An, Euiyun Jang, Jeongho Hwang |
2023-06-20 |
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Display device |
Myoung-Ha Jeon, Youngsoo Kim |
2022-01-18 |
| 10672853 |
Flexible display apparatus |
Seunghwa Ha, Euiyun Jang, Donghee Park |
2020-06-02 |
| 10217807 |
Anisotropic conductive film and display device using the same |
Chungseok Lee, Donghee Park, Cheolgeun An, Euiyun Jang, Jeongho Hwang |
2019-02-26 |
| 10088703 |
Method of manufacturing display device |
Changok Kim, Taeyoung Ahn, Sangwook Lee, Kiseong Seo, Junmo Im |
2018-10-02 |
| 10050227 |
Display apparatus |
Donghee Park, Cheolgeun An, Chungseok Lee, Euiyun Jang, Jeongho Hwang |
2018-08-14 |
| 9933655 |
Polarizer and display device comprising the same |
Taeyoung Ahn |
2018-04-03 |
| 9401347 |
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV |
SinJae Lee, JinGwan Kim, Jaehyun LIM, KyuWon Lee |
2016-07-26 |
| 9379064 |
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die |
SinJae Lee, JinGwan Kim |
2016-06-28 |
| 9196213 |
Gate driving circuit and display device having the same |
Cheolkyu Kim, Sanghyun Jeon |
2015-11-24 |
| 9048209 |
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die |
SinJae Lee, JinGwan Kim |
2015-06-02 |
| 8937371 |
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV |
SinJae Lee, JinGwan Kim, Jaehyun LIM, KyuWon Lee |
2015-01-20 |
| 8836114 |
Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers |
SinJae Lee, JinGwan Kim |
2014-09-16 |
| 8709932 |
Integrated circuit packaging system with interconnects and method of manufacture thereof |
Soo Won Lee, Sung Jun Yoon |
2014-04-29 |
| 8569870 |
Integrated circuit packaging system with shielding spacer and method of manufacture thereof |
SinJae Lee, JongVin Park, Sung Jun Yoon |
2013-10-29 |
| 8531012 |
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV |
SinJae Lee, JinGwan Kim, Jaehyun LIM, KyuWon Lee |
2013-09-10 |
| 8432028 |
Integrated circuit packaging system with package-on-package and method of manufacture thereof |
JinGwan Kim, KyuWon Lee, MoonKi Jeong, SunYoung Chun |
2013-04-30 |
| 8343810 |
Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers |
SinJae Lee, JinGwan Kim |
2013-01-01 |
| 8310038 |
Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof |
JinGwan Kim, KyuWon Lee, JongVin Park |
2012-11-13 |
| 8003496 |
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die |
SinJae Lee, JinGwan Kim |
2011-08-23 |
| 8004093 |
Integrated circuit package stacking system |
JinGwan Kim, Jaehyun LIM, SunYoung Chun, KyuWon Lee, SinJae Lee +1 more |
2011-08-23 |
| 7683469 |
Package-on-package system with heat spreader |
KyuWon Lee, Jaehyun LIM, JongVin Park, SinJae Lee |
2010-03-23 |
