JK

JinGwan Kim

SC Stats Chippac: 17 patents #69 of 425Top 20%
Overall (All Time): #266,414 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12412792 Compartment shielding with metal frame and cap Bokyeong Hwang, Minjung Kim 2025-09-09
11776861 Compartment shielding with metal frame and cap Bokyeong Hwang, Minjung Kim 2023-10-03
9401347 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV SinJae Lee, JiHoon Oh, Jaehyun LIM, KyuWon Lee 2016-07-26
9379064 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die JiHoon Oh, SinJae Lee 2016-06-28
9048209 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die JiHoon Oh, SinJae Lee 2015-06-02
8937371 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV SinJae Lee, JiHoon Oh, Jaehyun LIM, KyuWon Lee 2015-01-20
8932908 Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die KyuWon Lee, HyunSu Shin, Hun Jeong, SunYoung Chun 2015-01-13
8836114 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers JiHoon Oh, SinJae Lee 2014-09-16
8531012 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV SinJae Lee, JiHoon Oh, Jaehyun LIM, KyuWon Lee 2013-09-10
8502392 Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die KyuWon Lee, HyunSu Shin, Hun Jeong, SunYoung Chun 2013-08-06
8476135 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Hyunil Bae 2013-07-02
8432028 Integrated circuit packaging system with package-on-package and method of manufacture thereof KyuWon Lee, MoonKi Jeong, SunYoung Chun, JiHoon Oh 2013-04-30
8343810 Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers JiHoon Oh, SinJae Lee 2013-01-01
8310038 Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof KyuWon Lee, JiHoon Oh, JongVin Park 2012-11-13
8288202 Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die KyuWon Lee, HyunSu Shin, Hun Jeong, SunYoung Chun 2012-10-16
8003496 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die JiHoon Oh, SinJae Lee 2011-08-23
8004093 Integrated circuit package stacking system JiHoon Oh, Jaehyun LIM, SunYoung Chun, KyuWon Lee, SinJae Lee +1 more 2011-08-23