Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424595 | Semiconductor device and method of forming package with double-sided integrated passive device | TaeKeun Lee | 2025-09-23 |
| 9559046 | Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias | YoungChul Kim, Myungkil Lee | 2017-01-31 |
| 8816487 | Integrated circuit packaging system with package-in-package and method of manufacture thereof | YoungChul Kim, Myung Kil Lee | 2014-08-26 |
| 8476135 | Integrated circuit packaging system with vertical interconnects and method of manufacture thereof | JinGwan Kim | 2013-07-02 |