Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8816487 | Integrated circuit packaging system with package-in-package and method of manufacture thereof | Hyunil Bae, YoungChul Kim | 2014-08-26 |
| 8481371 | Thin package system with external terminals and method of manufacture thereof | Youngcheol Kim, Gwang Kim, Koo Hong Lee | 2013-07-09 |
| 8089143 | Integrated circuit package system using interposer | — | 2012-01-03 |
| 8026582 | Integrated circuit package system with internal stacking module adhesive | Jae-Chang Kim, Koo Hong Lee | 2011-09-27 |
| 7947535 | Thin package system with external terminals | Youngcheol Kim, Gwang Kim, Koo Hong Lee | 2011-05-24 |
| 7674640 | Stacked die package system | Jong-Woo Ha, Hyun Uk Kim, Taebok Jung | 2010-03-09 |
| 7279785 | Stacked die package system | Jong-Woo Ha, Hyun Uk Kim, Taebok Jung | 2007-10-09 |