Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7674640 | Stacked die package system | Jong-Woo Ha, Myung Kil Lee, Hyun Uk Kim | 2010-03-09 |
| 7436048 | Multichip leadframe package | Jongwoo Ha | 2008-10-14 |
| 7279785 | Stacked die package system | Jong-Woo Ha, Myung Kil Lee, Hyun Uk Kim | 2007-10-09 |
| 7208821 | Multichip leadframe package | Jongwoo Ha | 2007-04-24 |