Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374559 | Double-sided partial molded SiP module | HunTeak Lee, Junho Ye | 2025-07-29 |
| 12211803 | Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation | HunTeak Lee, Junho Ye, YouJoung Choi, Minkyung Kim, YongWoo Lee +1 more | 2025-01-28 |
| 11894314 | Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation | HunTeak Lee, Junho Ye, YouJoung Choi, Minkyung Kim, YongWoo Lee +1 more | 2024-02-06 |
| 11887863 | Double-sided partial molded SIP module | HunTeak Lee, Junho Ye | 2024-01-30 |
| 9129998 | Apparatus for cleaning an object and method of operating the same | Seung-Geun Kim, Sung-Soo Lee, Jae-Nam Lee | 2015-09-08 |
| 8481371 | Thin package system with external terminals and method of manufacture thereof | Youngcheol Kim, Myung Kil Lee, Koo Hong Lee | 2013-07-09 |