Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374559 | Double-sided partial molded SiP module | HunTeak Lee, Gwang Kim | 2025-07-29 |
| 12211803 | Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation | HunTeak Lee, Gwang Kim, YouJoung Choi, Minkyung Kim, YongWoo Lee +1 more | 2025-01-28 |
| 12211808 | Semiconductor device and method of forming discrete antenna modules | HunTeak Lee, Choon Heung Lee | 2025-01-28 |
| 11894314 | Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation | HunTeak Lee, Gwang Kim, YouJoung Choi, Minkyung Kim, YongWoo Lee +1 more | 2024-02-06 |
| 11887863 | Double-sided partial molded SIP module | HunTeak Lee, Gwang Kim | 2024-01-30 |
| 11735539 | Semiconductor device and method of forming discrete antenna modules | HunTeak Lee, Choon Heung Lee | 2023-08-22 |