JY

Junho Ye

SC Stats Chippac: 6 patents #48 of 253Top 20%
Overall (All Time): #773,080 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12374559 Double-sided partial molded SiP module HunTeak Lee, Gwang Kim 2025-07-29
12211803 Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation HunTeak Lee, Gwang Kim, YouJoung Choi, Minkyung Kim, YongWoo Lee +1 more 2025-01-28
12211808 Semiconductor device and method of forming discrete antenna modules HunTeak Lee, Choon Heung Lee 2025-01-28
11894314 Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation HunTeak Lee, Gwang Kim, YouJoung Choi, Minkyung Kim, YongWoo Lee +1 more 2024-02-06
11887863 Double-sided partial molded SIP module HunTeak Lee, Gwang Kim 2024-01-30
11735539 Semiconductor device and method of forming discrete antenna modules HunTeak Lee, Choon Heung Lee 2023-08-22