Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424579 | Integrated chip including an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance | Tzu-Yu Lin, Yao-Wen Chang, Yen-Liang Lin | 2025-09-23 |
| 12417946 | Film scheme to reduce plasma-induced damage | Yen-Liang Lin, Yao-Wen Chang | 2025-09-16 |
| 12369329 | Bottom-electrode interface structure for memory | Tzu-Yu Lin, Yao-Wen Chang | 2025-07-22 |
| 12211737 | Cleaning chamber for metal oxide removal | Yen-Liang Lin, Yao-Wen Chang, Min-Chang Ching, Kuo-Liang Lu, Cheng-Yuan Tsai +1 more | 2025-01-28 |
| 11973050 | Method for forming an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance | Tzu-Yu Lin, Yao-Wen Chang, Yen-Liang Lin | 2024-04-30 |
| 11792996 | Bottom-electrode interface structure for memory | Tzu-Yu Lin, Yao-Wen Chang | 2023-10-17 |