Issued Patents All Time
Showing 25 most recent of 146 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396305 | Semiconductor reconstitution | — | 2025-08-19 |
| 12355022 | Display projector systems and devices for augmented-reality | — | 2025-07-08 |
| 12224271 | Integrating control circuits with light emissive circuits with dissimilar wafer sizes | — | 2025-02-11 |
| 11942589 | Managing thermal resistance and planarity of a display package | — | 2024-03-26 |
| 11852835 | Artificial reality system having system-on-a-chip (soc) integrated circuit components including stacked sram | — | 2023-12-26 |
| 11842989 | Integrating control circuits with light emissive circuits with dissimilar wafer sizes | — | 2023-12-12 |
| 11668942 | Aligning a collimator assembly with LED arrays | — | 2023-06-06 |
| 11550158 | Artificial reality system having system-on-a-chip (SoC) integrated circuit components including stacked SRAM | — | 2023-01-10 |
| 11545475 | Integrated display devices | — | 2023-01-03 |
| 11508700 | Left and right projectors for display device | — | 2022-11-22 |
| 11362251 | Managing thermal resistance and planarity of a display package | — | 2022-06-14 |
| 11287656 | Aligning a collimator assembly with LED arrays | — | 2022-03-29 |
| 11251154 | Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration | — | 2022-02-15 |
| 11037915 | Integrated display devices | — | 2021-06-15 |
| 10700041 | Stacking of three-dimensional circuits including through-silicon-vias | — | 2020-06-30 |
| 10692836 | Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration | — | 2020-06-23 |
| 10580749 | Semiconductor device and method of forming high routing density interconnect sites on substrate | — | 2020-03-03 |
| RE47600 | Semiconductor device and method of forming electrical interconnect with stress relief void | — | 2019-09-10 |
| 10388612 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi +1 more | 2019-08-20 |
| 10388626 | Semiconductor device and method of forming flipchip interconnect structure | — | 2019-08-20 |
| 10002857 | Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer | Michael James Solimando, William Stone, John Holmes, Christopher J. Healy, Sun Hyuck Yun | 2018-06-19 |
| 9922915 | Bump-on-lead flip chip interconnection | — | 2018-03-20 |
| 9899286 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2018-02-20 |
| 9881894 | Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration | — | 2018-01-30 |
| 9865556 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2018-01-09 |