Issued Patents All Time
Showing 26–50 of 146 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847309 | Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate | — | 2017-12-19 |
| 9780057 | Semiconductor device and method of forming pad layout for flipchip semiconductor die | — | 2017-10-03 |
| 9773685 | Solder joint flip chip interconnection having relief structure | KyungOe Kim, TaeWoo Kang | 2017-09-26 |
| 9754897 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi +1 more | 2017-09-05 |
| 9679811 | Semiconductor device and method of confining conductive bump material with solder mask patch | — | 2017-06-13 |
| 9679824 | Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP | Reza A. Pagaila, Jun Mo Koo | 2017-06-13 |
| 9545013 | Flip chip interconnect solder mask | — | 2017-01-10 |
| 9545014 | Flip chip interconnect solder mask | — | 2017-01-10 |
| 9484319 | Semiconductor device and method of forming extended semiconductor device with fan-out interconnect structure to reduce complexity of substrate | — | 2016-11-01 |
| 9472533 | Semiconductor device and method of forming wire bondable fan-out EWLB package | — | 2016-10-18 |
| 9385101 | Semiconductor device and method of forming bump-on-lead interconnection | — | 2016-07-05 |
| 9385074 | Semiconductor package with embedded die | — | 2016-07-05 |
| 9379084 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2016-06-28 |
| 9373573 | Solder joint flip chip interconnection | KyungOe Kim, TaeWoo Kang | 2016-06-21 |
| 9345148 | Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad | — | 2016-05-17 |
| 9312150 | Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package | Nazir Ahmad, Young Do Kweon, Samuel Tam, Kyung-Moon Kim | 2016-04-12 |
| 9263361 | Semiconductor device having a vertical interconnect structure using stud bumps | Reza A. Pagaila, Byung Tai Do, Shuangwu Huang | 2016-02-16 |
| 9258904 | Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings | — | 2016-02-09 |
| 9219045 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2015-12-22 |
| 9159665 | Flip chip interconnection having narrow interconnection sites on the substrate | — | 2015-10-13 |
| 9125332 | Filp chip interconnection structure with bump on partial pad and method thereof | Youngcheol Kim, TaeKeun Lee, GuiChea Na, Gwangjin Kim | 2015-09-01 |
| 9064858 | Semiconductor device and method of forming bump-on-lead interconnection | — | 2015-06-23 |
| 9054084 | Integrated circuit having staggered bond pads and I/O cells | — | 2015-06-09 |
| 9029196 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2015-05-12 |
| 8987014 | Semiconductor wafer and method of forming sacrificial bump pad for wafer probing during wafer sort test | — | 2015-03-24 |