Issued Patents All Time
Showing 76–100 of 146 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8476761 | Semiconductor device and method of confining conductive bump material during reflow with solder mask patch | — | 2013-07-02 |
| 8466557 | Solder bump confinement system for an integrated circuit package | Yaojian Lin, Pandi C. Marimuthu | 2013-06-18 |
| 8435834 | Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP | Reza A. Pagaila, Jun Mo Koo | 2013-05-07 |
| 8409920 | Integrated circuit package system for package stacking and method of manufacture therefor | Flynn Carson, Il Kwon Shim, Seng Guan Chow | 2013-04-02 |
| 8350384 | Semiconductor device and method of forming electrical interconnect with stress relief void | — | 2013-01-08 |
| 8318537 | Flip chip interconnection having narrow interconnection sites on the substrate | — | 2012-11-27 |
| 8304919 | Integrated circuit system with stress redistribution layer and method of manufacture thereof | Chien Ouyang, Mukul Joshi | 2012-11-06 |
| 8278144 | Flip chip interconnect solder mask | — | 2012-10-02 |
| 8269356 | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates | Byung Joon Han, Hun Teak Lee | 2012-09-18 |
| 8217514 | Integrated circuit packaging system with warpage control system and method of manufacture thereof | — | 2012-07-10 |
| 8216930 | Solder joint flip chip interconnection having relief structure | KyungOe Kim, TaeWoo Kang | 2012-07-10 |
| 8212352 | Integrated circuit package system with heat sink spacer structures | — | 2012-07-03 |
| 8198186 | Semiconductor device and method of confining conductive bump material during reflow with solder mask patch | — | 2012-06-12 |
| 8193035 | Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps | — | 2012-06-05 |
| 8193034 | Semiconductor device and method of forming vertical interconnect structure using stud bumps | Reza A. Pagaila, Byung Tai Do, Shuangwu Huang | 2012-06-05 |
| 8188598 | Bump-on-lead flip chip interconnection | — | 2012-05-29 |
| 8174119 | Semiconductor package with embedded die | — | 2012-05-08 |
| 8141247 | Method of a package on package packaging | — | 2012-03-27 |
| 8143108 | Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate | — | 2012-03-27 |
| 8129837 | Flip chip interconnection pad layout | — | 2012-03-06 |
| 8129841 | Solder joint flip chip interconnection | KyungOe Kim, TaeWoo Kang | 2012-03-06 |
| 8129263 | Wire bond interconnection and method of manufacture thereof | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang | 2012-03-06 |
| 8124520 | Integrated circuit mount system with solder mask pad | KyungOe Kim, Haengcheol Choi, Kyung-Moon Kim | 2012-02-28 |
| 8119450 | Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots | Nazir Ahmad, Young Do Kweon, Samuel Tam, Kyung-Moon Kim | 2012-02-21 |
| 8076232 | Semiconductor device and method of forming composite bump-on-lead interconnection | — | 2011-12-13 |