Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9129826 | Epoxy bump for overhang die | Hun Teak Lee, Jong Kook Kim, Ki Youn Jang | 2015-09-08 |
| 8129263 | Wire bond interconnection and method of manufacture thereof | Hun Teak Lee, Jong Kook Kim, Ki Youn Jang, Rajendra D. Pendse | 2012-03-06 |
| 7986047 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Ki Youn Jang, Rajendra D. Pendse | 2011-07-26 |
| 7745322 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Ki Youn Jang, Rajendra D. Pendse | 2010-06-29 |
| 7453156 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Ki Youn Jang, Rajendra D. Pendse | 2008-11-18 |