Issued Patents All Time
Showing 101–125 of 146 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026128 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2011-09-27 |
| 7994636 | Flip chip interconnection structure | — | 2011-08-09 |
| 7994626 | Multi-layer semiconductor package with vertical connectors and method of manufacture thereof | — | 2011-08-09 |
| 7986047 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang | 2011-07-26 |
| 7973406 | Bump-on-lead flip chip interconnection | — | 2011-07-05 |
| 7901983 | Bump-on-lead flip chip interconnection | — | 2011-03-08 |
| 7868468 | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates | Byung Joon Han, HunTeak Lee | 2011-01-11 |
| 7759137 | Flip chip interconnection structure with bump on partial pad and method thereof | Youngcheol Kim, TaeKeun Lee, GuiChea Na, Gwangjin Kim | 2010-07-20 |
| 7750482 | Integrated circuit package system including zero fillet resin | — | 2010-07-06 |
| 7745322 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang | 2010-06-29 |
| 7736950 | Flip chip interconnection | Marcos Karnezos, Kyung-Moon Kim, Koo Hong Lee, Moon Hee Lee, Orion K. Starr | 2010-06-15 |
| 7723225 | Solder bump confinement system for an integrated circuit package | Yaojian Lin, Pandi C. Marimuthu | 2010-05-25 |
| 7713782 | Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps | — | 2010-05-11 |
| 7700407 | Method of forming a bump-on-lead flip chip interconnection having higher escape routing density | — | 2010-04-20 |
| 7659633 | Solder joint flip chip interconnection having relief structure | KyungOe Kim, TaeWoo Kang | 2010-02-09 |
| 7656021 | Integrated circuit package system with pedestal structure | — | 2010-02-02 |
| 7608921 | Multi-layer semiconductor package | — | 2009-10-27 |
| 7605480 | Flip chip interconnection pad layout | — | 2009-10-20 |
| 7550680 | Package-on-package system | — | 2009-06-23 |
| 7453156 | Wire bond interconnection | Hun Teak Lee, Jong Kook Kim, Chul-Sik Kim, Ki Youn Jang | 2008-11-18 |
| 7407877 | Self-coplanarity bumping shape for flip-chip | Young Do Kweon, Nazir Ahmad, Kyung-Moon Kim | 2008-08-05 |
| 7372170 | Flip chip interconnection pad layout | — | 2008-05-13 |
| 7368817 | Bump-on-lead flip chip interconnection | — | 2008-05-06 |
| 7367489 | Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps | — | 2008-05-06 |
| 7323774 | Integrated circuit package system with pedestal structure | — | 2008-01-29 |