Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9142481 | Integrated circuit packaging system with heatsink cap and method of manufacture thereof | JoungIn Yang, DokOk Yu, Hoon Jung, Jae Han Chung | 2015-09-22 |
| 9125332 | Filp chip interconnection structure with bump on partial pad and method thereof | Rajendra D. Pendse, Youngcheol Kim, TaeKeun Lee, GuiChea Na | 2015-09-01 |
| 8592989 | Integrated circuit package system with bump over via | GuiChea Na, Soohan Park | 2013-11-26 |
| 7759137 | Flip chip interconnection structure with bump on partial pad and method thereof | Rajendra D. Pendse, Youngcheol Kim, TaeKeun Lee, GuiChea Na | 2010-07-20 |