Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257384 | Integrated circuit packaging system with substrate and method of manufacture thereof | Sung Jun Yoon | 2016-02-09 |
| 8592989 | Integrated circuit package system with bump over via | GuiChea Na, Gwangjin Kim | 2013-11-26 |