Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9142481 | Integrated circuit packaging system with heatsink cap and method of manufacture thereof | Gwangjin Kim, JoungIn Yang, Hoon Jung, Jae Han Chung | 2015-09-22 |
| 8524538 | Integrated circuit packaging system with film assistance mold and method of manufacture thereof | Jaehyun Lee, Ki Youn Jang | 2013-09-03 |