Issued Patents All Time
Showing 126–146 of 146 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7211901 | Self-coplanarity bumping shape for flip chip | Young Do Kweon, Nazir Ahmad, Kyung-Moon Kim | 2007-05-01 |
| 7034391 | Flip chip interconnection pad layout | — | 2006-04-25 |
| 7033859 | Flip chip interconnection structure | — | 2006-04-25 |
| 6940178 | Self-coplanarity bumping shape for flip chip | Young Do Kweon, Nazir Ahmad, Kyung-Moon Kim | 2005-09-06 |
| 6828220 | Flip chip-in-leadframe package and process | Marcos Karnezos, Walter A. Bush, Jr. | 2004-12-07 |
| 6815252 | Method of forming flip chip interconnection structure | — | 2004-11-09 |
| 6780682 | Process for precise encapsulation of flip chip interconnects | — | 2004-08-24 |
| 6737295 | Chip scale package with flip chip interconnect | Nazir Ahmad, Andrea Chen, Kyung-Moon Kim, Young Do Kweon, Samuel Tam | 2004-05-18 |
| 6417573 | High temperature flip chip joining flux that obviates the cleaning process | — | 2002-07-09 |
| 6059894 | High temperature flip chip joining flux that obviates the cleaning process | — | 2000-05-09 |
| 5920200 | Apparatus and method for precise alignment of a ceramic module to a test apparatus | Jaime L. Del Campo | 1999-07-06 |
| 5818114 | Radially staggered bond pad arrangements for integrated circuit pad circuitry | Rita Horner | 1998-10-06 |
| 5768776 | Method for forming a controlled impedance flex circuit | — | 1998-06-23 |
| 5764486 | Cost effective structure and method for interconnecting a flip chip with a substrate | — | 1998-06-09 |
| 5528462 | Direct chip connection using demountable flip chip package | — | 1996-06-18 |
| 5468994 | High pin count package for semiconductor device | — | 1995-11-21 |
| 5448020 | System and method for forming a controlled impedance flex circuit | — | 1995-09-05 |
| 5376588 | Method for making high pin count package for semiconductor device | — | 1994-12-27 |
| 5262925 | Tab frame with area array edge contacts | Farid Matta, Kevin Douglas, Brahram Afshari, Kenneth D. Scholz | 1993-11-16 |
| 5162975 | Integrated circuit demountable TAB apparatus | Farid Matta, Kevin Douglas, Brahram Afshari, Kenneth D. Scholz | 1992-11-10 |
| 5049976 | Stress reduction package and process | Jeffrey C. Demmin | 1991-09-17 |