Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8446926 | Broad-area edge-emitting semiconductor laser with limited thermal contact | David Schleuning | 2013-05-21 |
| 8233513 | Broad-area edge-emitting semiconductor laser with limited thermal contact | David Schleuning | 2012-07-31 |
| 6718085 | Stable optical switch with reduced power consumption | John Uebbing, Julie E. Fouquet, Stephan Hengstler, Tyler Sims | 2004-04-06 |
| 6011314 | Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps | Jacques Leibovitz, Park-Kee Yu, Ya Yun Zhu, Maria L. Cobarruviaz, Susan Swindlehurst +1 more | 2000-01-04 |
| 5399528 | Multi-layer fabrication in integrated circuit systems | Jacques Leibovitz, Maria L. Cobarruviaz, Clinton Chao | 1995-03-21 |
| 5329423 | Compressive bump-and-socket interconnection scheme for integrated circuits | — | 1994-07-12 |
| 5262925 | Tab frame with area array edge contacts | Farid Matta, Kevin Douglas, Rajendra D. Pendse, Brahram Afshari | 1993-11-16 |
| 5200300 | Methods for forming high density multi-chip carriers | Jacques Leibovitz, Maria L. Cobarruviaz, Clinton Chao | 1993-04-06 |
| 5162260 | Stacked solid via formation in integrated circuit systems | Jacques Leibovitz, Maria L. Cobarruviaz, Clinton Chao | 1992-11-10 |
| 5162975 | Integrated circuit demountable TAB apparatus | Farid Matta, Kevin Douglas, Rajendra D. Pendse, Brahram Afshari | 1992-11-10 |
| 5086335 | Tape automated bonding system which facilitate repair | Jacques Leibovitz, V. K. Nagesh, Clinton Chao | 1992-02-04 |
| 5055425 | Stacked solid via formation in integrated circuit systems | Jacques Leibovitz, Maria L. Cobarruviaz, Clinton Chao | 1991-10-08 |