Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7088397 | Image sensor packaging with imaging optics | Andrew Hunter, James Chang, Ray Schuder | 2006-08-08 |
| 6683298 | Image sensor packaging with package cavity sealed by the imaging optics | Andrew Hunter, Ray Schuder, James Chang | 2004-01-27 |
| 6011314 | Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps | Jacques Leibovitz, Ya Yun Zhu, Maria L. Cobarruviaz, Susan Swindlehurst, Cheng-Cheng Chang +1 more | 2000-01-04 |