| 6268656 |
Method and structure for uniform height solder bumps on a semiconductor wafer |
Susan Swindlehurst |
2001-07-31 |
| 6146984 |
Method and structure for uniform height solder bumps on a semiconductor wafer |
Susan Swindlehurst |
2000-11-14 |
| 6085968 |
Solder retention ring for improved solder bump formation |
Susan Swindlehurst, Hubert A. Vander Plas |
2000-07-11 |
| 6011314 |
Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps |
Park-Kee Yu, Ya Yun Zhu, Maria L. Cobarruviaz, Susan Swindlehurst, Cheng-Cheng Chang +1 more |
2000-01-04 |
| 5749988 |
Reworkable die attachment to heat spreader |
Peter F. Dawson, Voddarahalli K. Nagesh, Greg M. Irby |
1998-05-12 |
| 5621615 |
Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
Peter F. Dawson, Voddarahalli K. Nagesh |
1997-04-15 |
| 5585671 |
Reliable low thermal resistance package for high power flip clip ICs |
Voddarahalli K. Nagesh, Kim Hong Chen, Cheng-Cheng Chang, Bahram Afshari |
1996-12-17 |
| 5484964 |
Surface mounting pin grid arrays |
Peter F. Dawson, by Shirley B. Dawson, executor, Voddarahalli K. Nagesh |
1996-01-16 |
| 5399528 |
Multi-layer fabrication in integrated circuit systems |
Maria L. Cobarruviaz, Kenneth D. Scholz, Clinton Chao |
1995-03-21 |
| 5268048 |
Reworkable die attachment |
Hilmar W. Spieth, Peter F. Dawson, Voddarahalli K. Nagesh |
1993-12-07 |
| 5221421 |
Controlled etching process for forming fine-geometry circuit lines on a substrate |
Daniel J. Miller, Maria L. Cobarruviaz, John P. Scalia, Howard H. Nakano, Voddarahalli K. Nagesh +1 more |
1993-06-22 |
| 5199165 |
Heat pipe-electrical interconnect integration method for chip modules |
Robert K. Crawford, Daniel J. Miller, Kim Hong Chen |
1993-04-06 |
| 5200300 |
Methods for forming high density multi-chip carriers |
Maria L. Cobarruviaz, Kenneth D. Scholz, Clinton Chao |
1993-04-06 |
| 5162260 |
Stacked solid via formation in integrated circuit systems |
Maria L. Cobarruviaz, Kenneth D. Scholz, Clinton Chao |
1992-11-10 |
| 5161090 |
Heat pipe-electrical interconnect integration for chip modules |
Robert K. Crawford, Daniel J. Miller, Kim Hong Chen |
1992-11-03 |
| 5086335 |
Tape automated bonding system which facilitate repair |
Kenneth D. Scholz, V. K. Nagesh, Clinton Chao |
1992-02-04 |
| 5055425 |
Stacked solid via formation in integrated circuit systems |
Maria L. Cobarruviaz, Kenneth D. Scholz, Clinton Chao |
1991-10-08 |
| 5029386 |
Hierarchical tape automated bonding method |
Clinton Chao, Kim Chen, Edith P. Prather |
1991-07-09 |
| 5011819 |
Process using supercritical conditions for producing highly accurate and homogeneous powder mixture useful in fabrication of high quality ceramic superconductors |
— |
1991-04-30 |