Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6268656 | Method and structure for uniform height solder bumps on a semiconductor wafer | Susan Swindlehurst | 2001-07-31 |
| 6146984 | Method and structure for uniform height solder bumps on a semiconductor wafer | Susan Swindlehurst | 2000-11-14 |
| 6085968 | Solder retention ring for improved solder bump formation | Susan Swindlehurst, Hubert A. Vander Plas | 2000-07-11 |
| 6011314 | Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps | Park-Kee Yu, Ya Yun Zhu, Maria L. Cobarruviaz, Susan Swindlehurst, Cheng-Cheng Chang +1 more | 2000-01-04 |
| 5749988 | Reworkable die attachment to heat spreader | Peter F. Dawson, Voddarahalli K. Nagesh, Greg M. Irby | 1998-05-12 |
| 5621615 | Low cost, high thermal performance package for flip chips with low mechanical stress on chip | Peter F. Dawson, Voddarahalli K. Nagesh | 1997-04-15 |
| 5585671 | Reliable low thermal resistance package for high power flip clip ICs | Voddarahalli K. Nagesh, Kim Hong Chen, Cheng-Cheng Chang, Bahram Afshari | 1996-12-17 |
| 5484964 | Surface mounting pin grid arrays | Peter F. Dawson, by Shirley B. Dawson, executor, Voddarahalli K. Nagesh | 1996-01-16 |
| 5399528 | Multi-layer fabrication in integrated circuit systems | Maria L. Cobarruviaz, Kenneth D. Scholz, Clinton Chao | 1995-03-21 |
| 5268048 | Reworkable die attachment | Hilmar W. Spieth, Peter F. Dawson, Voddarahalli K. Nagesh | 1993-12-07 |
| 5221421 | Controlled etching process for forming fine-geometry circuit lines on a substrate | Daniel J. Miller, Maria L. Cobarruviaz, John P. Scalia, Howard H. Nakano, Voddarahalli K. Nagesh +1 more | 1993-06-22 |
| 5199165 | Heat pipe-electrical interconnect integration method for chip modules | Robert K. Crawford, Daniel J. Miller, Kim Hong Chen | 1993-04-06 |
| 5200300 | Methods for forming high density multi-chip carriers | Maria L. Cobarruviaz, Kenneth D. Scholz, Clinton Chao | 1993-04-06 |
| 5162260 | Stacked solid via formation in integrated circuit systems | Maria L. Cobarruviaz, Kenneth D. Scholz, Clinton Chao | 1992-11-10 |
| 5161090 | Heat pipe-electrical interconnect integration for chip modules | Robert K. Crawford, Daniel J. Miller, Kim Hong Chen | 1992-11-03 |
| 5086335 | Tape automated bonding system which facilitate repair | Kenneth D. Scholz, V. K. Nagesh, Clinton Chao | 1992-02-04 |
| 5055425 | Stacked solid via formation in integrated circuit systems | Maria L. Cobarruviaz, Kenneth D. Scholz, Clinton Chao | 1991-10-08 |
| 5029386 | Hierarchical tape automated bonding method | Clinton Chao, Kim Chen, Edith P. Prather | 1991-07-09 |
| 5011819 | Process using supercritical conditions for producing highly accurate and homogeneous powder mixture useful in fabrication of high quality ceramic superconductors | — | 1991-04-30 |