| 8881639 |
Hybrid body armor |
Autar Kaw |
2014-11-11 |
| 8330556 |
Passivation layers in acoustic resonators |
Martha Johnson |
2012-12-11 |
| 6958446 |
Compliant and hermetic solder seal |
Giles Humpston, Yoshikatsu Ichimura, Nancy M. Mar, Michael J. Nystrom, Heidi Linch Reynolds +1 more |
2005-10-25 |
| 6732905 |
Vented cavity, hermetic solder seal |
Giles Humpston, Yoshikatsu Ichimura, Nancy M. Mar, Michael J. Nystrom, Gary R. Trott |
2004-05-11 |
| 6242075 |
Planar multilayer ceramic structures with near surface channels |
Clinton Chao, Hubert A. VanderPlas |
2001-06-05 |
| 5426405 |
Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects |
Kim Hong Chen, Lewis R. Dove, Vaddoarahalli K. Nagesh |
1995-06-20 |
| 5409157 |
Composite transversely plastic interconnect for microchip carrier |
Voddarahalli K. Nagesh, Robert A. Schuchard, Jeffrey G. Hargis |
1995-04-25 |
| 5324569 |
Composite transversely plastic interconnect for microchip carrier |
Voddarahalli K. Nagesh, Robert A. Schuchard, Jeffrey G. Hargis |
1994-06-28 |
| 5221421 |
Controlled etching process for forming fine-geometry circuit lines on a substrate |
Jacques Leibovitz, Maria L. Cobarruviaz, John P. Scalia, Howard H. Nakano, Voddarahalli K. Nagesh +1 more |
1993-06-22 |
| 5199165 |
Heat pipe-electrical interconnect integration method for chip modules |
Robert K. Crawford, Jacques Leibovitz, Kim Hong Chen |
1993-04-06 |
| 5161090 |
Heat pipe-electrical interconnect integration for chip modules |
Robert K. Crawford, Jacques Leibovitz, Kim Hong Chen |
1992-11-03 |
| 5045526 |
Making insulated superconductor wire |
V. K. Nagesh |
1991-09-03 |