| 12174368 |
Wire bonded common electrical connection in a piezoelectric micro-electro-mechanical system scanning mirror assembly |
— |
2024-12-24 |
$262,656,000 |
| 11656454 |
Steerable optical assemblies |
Chuan Pu, Jincheng Wang, Kingsuk Maitra |
2023-05-23 |
$326,580,000 |
| 11555999 |
Wire bonded common electrical connection in a piezoelectric micro-electro-mechanical system scanning mirror assembly |
— |
2023-01-17 |
$212,156,000 |
| 11175492 |
Substrate for scanning mirror system |
Wyatt O. Davis, Jincheng Wang |
2021-11-16 |
$286,400,000 |
| 11163151 |
Anisotropic conductive adhesive bond in a piezoelectric micro-electro-mechanical system scanning mirror system |
Joseph Luizzi |
2021-11-02 |
$226,584,000 |
| 11125969 |
Bonding of resonant oscillating mirror to frame |
— |
2021-09-21 |
$157,007,000 |
| 11016289 |
Micromirror actuator assembly |
— |
2021-05-25 |
$143,510,000 |
| 10962766 |
Adhesive bonded micro electro mechanical system |
Joseph Luizzi, Seungwoo Lee, Utku Baran, Robert J. Dyer |
2021-03-30 |
$145,552,000 |
| 10895713 |
Actuator frame for scanning mirror |
Jincheng Wang, Wyatt O. Davis, Joshua O. Miller, Richard A. James |
2021-01-19 |
$251,618,000 |
| 10890755 |
Steerable optical assemblies |
Chuan Pu, Jincheng Wang, Kingsuk Maitra |
2021-01-12 |
$215,405,000 |
| 10712550 |
Colocating signal processing device with micromechanical scanning silicon mirror |
Mark Champion |
2020-07-14 |
$94,985,000 |
| 9874774 |
Method and apparatus for testing operation of an optical liquid crystal device |
Bahram Afshari, Karen Asatryan, Peter P. Clark, Tigran Galstian, Vladimir Presniakov +2 more |
2018-01-23 |
|
| 9548145 |
Microelectronic assembly with multi-layer support structure |
Giles Humpston |
2017-01-17 |
|
| 9239479 |
Calibration of tunable liquid crystal optical device |
Behzad Khodadad, Bahram Afshari, Karen Asatryan, Tigran Galstian |
2016-01-19 |
|
| 9140920 |
Method and apparatus for testing operation of an optical liquid crystal device |
Bahram Afshari, Karen Asatryan, Peter P. Clark, Tigran Galstian, Vladimir Presniakov +2 more |
2015-09-22 |
|
| 8604605 |
Microelectronic assembly with multi-layer support structure |
Giles Humpston |
2013-12-10 |
|
| 8558985 |
Contact structure for a tunable liquid crystal optical device |
Viktor Konovalov, Rubin Ma, Amir Tork, Aram Bagramyan, Vladimir Presniakov |
2013-10-15 |
|
| 7936062 |
Wafer level chip packaging |
Giles Humpston, Vage Oganesian, Yulia Aksenton, Osher Avsian, Robert Burtzlaff +7 more |
2011-05-03 |
|
| 7858445 |
Wire bonded wafer level cavity package |
Kenneth Honer, Giles Humpston, David B. Tuckerman |
2010-12-28 |
$8,494,000 |
| 7737513 |
Chip assembly including package element and integrated circuit chip |
Belgacem Haba, Charles White |
2010-06-15 |
$8,464,000 |
| 7593636 |
Pin referenced image sensor to reduce tilt in a camera module |
David B. Tuckerman, Belgacem Haba, Giles Humpston, Jesse Thompson |
2009-09-22 |
$27,293,000 |
| 7569424 |
Method of forming a wall structure in a microelectronic assembly |
Christopher Wade, Giles Humpston |
2009-08-04 |
$27,727,000 |
| 7521276 |
Compliant terminal mountings with vented spaces and methods |
Belgacem Haba, Giles Humpston |
2009-04-21 |
$6,162,000 |
| 7453139 |
Compliant terminal mountings with vented spaces and methods |
Belgacem Haba, Giles Humpston |
2008-11-18 |
$9,042,000 |
| 7449779 |
Wire bonded wafer level cavity package |
Kenneth Honer, Giles Humpston, David B. Tuckerman |
2008-11-11 |
$19,292,000 |
