Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12174368 | Wire bonded common electrical connection in a piezoelectric micro-electro-mechanical system scanning mirror assembly | — | 2024-12-24 |
| 11656454 | Steerable optical assemblies | Chuan Pu, Jincheng Wang, Kingsuk Maitra | 2023-05-23 |
| 11555999 | Wire bonded common electrical connection in a piezoelectric micro-electro-mechanical system scanning mirror assembly | — | 2023-01-17 |
| 11175492 | Substrate for scanning mirror system | Wyatt O. Davis, Jincheng Wang | 2021-11-16 |
| 11163151 | Anisotropic conductive adhesive bond in a piezoelectric micro-electro-mechanical system scanning mirror system | Joseph Luizzi | 2021-11-02 |
| 11125969 | Bonding of resonant oscillating mirror to frame | — | 2021-09-21 |
| 11016289 | Micromirror actuator assembly | — | 2021-05-25 |
| 10962766 | Adhesive bonded micro electro mechanical system | Joseph Luizzi, Seungwoo Lee, Utku Baran, Robert J. Dyer | 2021-03-30 |
| 10895713 | Actuator frame for scanning mirror | Jincheng Wang, Wyatt O. Davis, Joshua O. Miller, Richard A. James | 2021-01-19 |
| 10890755 | Steerable optical assemblies | Chuan Pu, Jincheng Wang, Kingsuk Maitra | 2021-01-12 |
| 10712550 | Colocating signal processing device with micromechanical scanning silicon mirror | Mark Champion | 2020-07-14 |
| 9874774 | Method and apparatus for testing operation of an optical liquid crystal device | Bahram Afshari, Karen Asatryan, Peter P. Clark, Tigran Galstian, Vladimir Presniakov +2 more | 2018-01-23 |
| 9548145 | Microelectronic assembly with multi-layer support structure | Giles Humpston | 2017-01-17 |
| 9239479 | Calibration of tunable liquid crystal optical device | Behzad Khodadad, Bahram Afshari, Karen Asatryan, Tigran Galstian | 2016-01-19 |
| 9140920 | Method and apparatus for testing operation of an optical liquid crystal device | Bahram Afshari, Karen Asatryan, Peter P. Clark, Tigran Galstian, Vladimir Presniakov +2 more | 2015-09-22 |
| 8604605 | Microelectronic assembly with multi-layer support structure | Giles Humpston | 2013-12-10 |
| 8558985 | Contact structure for a tunable liquid crystal optical device | Viktor Konovalov, Rubin Ma, Amir Tork, Aram Bagramyan, Vladimir Presniakov | 2013-10-15 |
| 7936062 | Wafer level chip packaging | Giles Humpston, Vage Oganesian, Yulia Aksenton, Osher Avsian, Robert Burtzlaff +7 more | 2011-05-03 |
| 7858445 | Wire bonded wafer level cavity package | Kenneth Honer, Giles Humpston, David B. Tuckerman | 2010-12-28 |
| 7737513 | Chip assembly including package element and integrated circuit chip | Belgacem Haba, Charles White | 2010-06-15 |
| 7593636 | Pin referenced image sensor to reduce tilt in a camera module | David B. Tuckerman, Belgacem Haba, Giles Humpston, Jesse Thompson | 2009-09-22 |
| 7569424 | Method of forming a wall structure in a microelectronic assembly | Christopher Wade, Giles Humpston | 2009-08-04 |
| 7521276 | Compliant terminal mountings with vented spaces and methods | Belgacem Haba, Giles Humpston | 2009-04-21 |
| 7453139 | Compliant terminal mountings with vented spaces and methods | Belgacem Haba, Giles Humpston | 2008-11-18 |
| 7449779 | Wire bonded wafer level cavity package | Kenneth Honer, Giles Humpston, David B. Tuckerman | 2008-11-11 |