Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wire bonded common electrical connection in a piezoelectric micro-electro-mechanical system scanning mirror assembly

Wire bonded common electrical connection in a piezoelectric micro-electro-mechanical system scanning mirror assembly

US Patent 12174368 · Granted Dec 24, 2024

Estimated economic value: $262,656,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Steerable optical assemblies2023
Wire bonded common electrical connection in a piezoelectric micro-electro-mechan2023
Substrate for scanning mirror system2021
Anisotropic conductive adhesive bond in a piezoelectric micro-electro-mechanical2021
Bonding of resonant oscillating mirror to frame2021
Micromirror actuator assembly2021
Adhesive bonded micro electro mechanical system2021
Actuator frame for scanning mirror2021
Steerable optical assemblies2021
Colocating signal processing device with micromechanical scanning silicon mirror2020
Method and apparatus for testing operation of an optical liquid crystal device2018
Microelectronic assembly with multi-layer support structure2017