Issued Patents All Time
Showing 1–25 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11408589 | Monolithic multi-focus light source device | — | 2022-08-09 |
| 11004930 | High density three-dimensional integrated capacitors | Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2021-05-11 |
| 10804151 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Ilyas Mohammed | 2020-10-13 |
| 10559494 | Microelectronic elements with post-assembly planarization | Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2020-02-11 |
| 10354942 | Staged via formation from both sides of chip | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2019-07-16 |
| 10262947 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2019-04-16 |
| 10199519 | Method of making a sensor package with cooling feature | Zhenhua Lu | 2019-02-05 |
| 10199275 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Ilyas Mohammed | 2019-02-05 |
| 10157978 | High density three-dimensional integrated capacitors | Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2018-12-18 |
| 10139619 | Back side illumination image sensor with non-planar optical interface | Zhenhua Lu | 2018-11-27 |
| 10032646 | Robust multi-layer wiring elements and assemblies with embedded microelectronic elements | Belgacem Haba, Kimitaka Endo | 2018-07-24 |
| 9996725 | Under screen sensor assembly | — | 2018-06-12 |
| 9985063 | Imaging device with photo detectors and color filters arranged by color transmission characteristics and absorption coefficients | Zhenhua Lu | 2018-05-29 |
| 9972730 | Method of making a sensor package with cooling feature | Zhenhua Lu | 2018-05-15 |
| 9966303 | Microelectronic elements with post-assembly planarization | Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2018-05-08 |
| 9899353 | Off-chip vias in stacked chips | Belgacem Haba, Ilyas Mohammed, David Ovrutsky, Laura Wills Mirkarimi | 2018-02-20 |
| 9893213 | Method of forming a wire bond sensor package | Zhenhua Lu | 2018-02-13 |
| 9893218 | Sensor package with cooling feature | Zhenhua Lu | 2018-02-13 |
| 9859220 | Laminated chip having microelectronic element embedded therein | Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2018-01-02 |
| 9853079 | Method of forming a stress released image sensor package structure | Zhenhua Lu | 2017-12-26 |
| 9847277 | Staged via formation from both sides of chip | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2017-12-19 |
| 9812360 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Ilyas Mohammed | 2017-11-07 |
| 9666730 | Wire bond sensor package | Zhenhua Lu | 2017-05-30 |
| 9667900 | Three dimensional system-on-chip image sensor package | Zhenhua Lu | 2017-05-30 |
| 9666625 | Method of making low profile sensor package with cooling feature | Zhenhua Lu | 2017-05-30 |