Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12393021 | Optical components for ghost image suppression systems and methods | Gregory Fitzgerald, Alan D. Kathman | 2025-08-19 |
| 12389090 | Imager optical systems and methods | William J. Hall | 2025-08-12 |
| 12345862 | Wide field of view imaging systems and methods | — | 2025-07-01 |
| 11982797 | Aspect ratio modifying imaging systems and methods | Michael D. Walters, Alan D. Kathman | 2024-05-14 |
| 11063159 | Methods for routing electrical interconnections and resultant structures | Hagit Gershtenman-Avsian, Andrey Grinman, Alexander Feldman, Alan D. Kathman | 2021-07-13 |
| 10818550 | Methods for singulation and packaging | Hagit Gershtenman-Avsian, Alexander Feldman, Andrey Grinman | 2020-10-27 |
| 10409041 | TIR imaging lens, image capturing system having the same, and associated methods | Jeremy Huddleston, Paul Elliott, David A. Keller, Richard J. Jones, Thomas Mercier | 2019-09-10 |
| 9910239 | Wafer level optical elements and applications thereof | William Hudson Welch, Roman C. Gutierrez, Robert J. Calvet | 2018-03-06 |
| 9899353 | Off-chip vias in stacked chips | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, Laura Wills Mirkarimi | 2018-02-20 |
| 9548254 | Packaged semiconductor chips with array | Andrey Grinman, Charles Rosenstein, Vage Oganesian | 2017-01-17 |
| 9070678 | Packaged semiconductor chips with array | Andrey Grinman, Charles Rosenstein, Vage Oganesian | 2015-06-30 |
| 9048234 | Off-chip vias in stacked chips | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, Laura Wills Mirkarimi | 2015-06-02 |
| 9030745 | Wafer level optical elements and applications thereof | Jeremy Huddleston | 2015-05-12 |
| 8883562 | Reconstituted wafer stack packaging with after-applied pad extensions | Belgacem Haba, Giles Humpston, Laura Wills Mirkarimi | 2014-11-11 |
| 8885257 | Focus compensation for optical elements and applications thereof | Hagit Gershtenman-Avsian, Alan D. Kathman, Jennifer Plyler | 2014-11-11 |
| 8848301 | Focus compensation for optical elements and applications thereof | William Hudson Welch, Andrew Aranda | 2014-09-30 |
| 8759973 | Microelectronic assemblies having compliancy and methods therefor | Vage Oganesian, Guilian Gao, Belgacem Haba | 2014-06-24 |
| 8704347 | Packaged semiconductor chips | Andrey Grinman, Charles Rosenstein, Belgacem Haba, Vage Oganesian | 2014-04-22 |
| 8687294 | Recessed optical surfaces | Gregory J. Kintz, Michael R. Feldman, James E. Morris, Paul Elliott, David A. Keller +3 more | 2014-04-01 |
| 8653644 | Packaged semiconductor chips with array | Andrey Grinman, Charles Rosenstein, Vage Oganesian | 2014-02-18 |
| 8569876 | Packaged semiconductor chips with array | Andrey Grinman, Charles Rosenstein, Vage Oganesian | 2013-10-29 |
| 8476774 | Off-chip VIAS in stacked chips | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, Laura Wills Mirkarimi | 2013-07-02 |
| 8461672 | Reconstituted wafer stack packaging with after-applied pad extensions | Belgacem Haba, Giles Humpston, Laura Wills Mirkarimi | 2013-06-11 |
| 8422138 | Wafer level optical elements and applications thereof | Jeremy Huddleston | 2013-04-16 |
| 8189277 | Recessed optical surfaces | Gregory J. Kintz, Michael R. Feldman, James E. Morris, Paul Elliott, David A. Keller +3 more | 2012-05-29 |