Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063159 | Methods for routing electrical interconnections and resultant structures | Hagit Gershtenman-Avsian, Alexander Feldman, Alan D. Kathman, David Ovrutsky | 2021-07-13 |
| 10818550 | Methods for singulation and packaging | David Ovrutsky, Hagit Gershtenman-Avsian, Alexander Feldman | 2020-10-27 |
| 9548254 | Packaged semiconductor chips with array | David Ovrutsky, Charles Rosenstein, Vage Oganesian | 2017-01-17 |
| 9070678 | Packaged semiconductor chips with array | David Ovrutsky, Charles Rosenstein, Vage Oganesian | 2015-06-30 |
| 8704347 | Packaged semiconductor chips | David Ovrutsky, Charles Rosenstein, Belgacem Haba, Vage Oganesian | 2014-04-22 |
| 8653644 | Packaged semiconductor chips with array | David Ovrutsky, Charles Rosenstein, Vage Oganesian | 2014-02-18 |
| 8569876 | Packaged semiconductor chips with array | David Ovrutsky, Charles Rosenstein, Vage Oganesian | 2013-10-29 |
| 8551815 | Stack packages using reconstituted wafers | Osher Avsian, Giles Humpston, Moti Margalit | 2013-10-08 |
| 7936062 | Wafer level chip packaging | Giles Humpston, Michael J. Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian +7 more | 2011-05-03 |
| 7807508 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Vage Oganesian, Charles Rosenstein, Felix Hazanovich, David Ovrutsky, Avi Dayan +2 more | 2010-10-05 |
| 7791199 | Packaged semiconductor chips | David Ovrutsky, Charles Rosenstein, Belgacem Haba, Vage Oganesian | 2010-09-07 |