Issued Patents All Time
Showing 51–75 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9233511 | Method of making stamped multi-layer polymer lens | Zhenhua Lu | 2016-01-12 |
| 9230947 | Method of forming 3D integrated microelectronic assembly with stress reducing interconnects | — | 2016-01-05 |
| 9224649 | Compliant interconnects in wafers | Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2015-12-29 |
| 9219091 | Low profile sensor module and method of making same | Zhenhua Lu | 2015-12-22 |
| 9214592 | Method of making interposer package for CMOS image sensor | — | 2015-12-15 |
| 9196650 | Method of forming a low profile image sensor package | — | 2015-11-24 |
| 9190463 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh, Piyush Savalia | 2015-11-17 |
| 9190443 | Low profile image sensor | Zhenhua Lu | 2015-11-17 |
| 9142508 | Single exposure in multi-damascene process | Cyprian Emeka Uzoh, Ilyas Mohammed, Craig Mitchell, Belgacem Haba | 2015-09-22 |
| 9142695 | Sensor package with exposed sensor array and method of making same | Zhenhua Lu | 2015-09-22 |
| 9123703 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, IIyas Mohammed | 2015-09-01 |
| 9125333 | Electrical barrier layers | Cyprian Emeka Uzoh, Ilyas Mohammed, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2015-09-01 |
| 9099296 | Stacked microelectronic assembly with TSVS formed in stages with plural active chips | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2015-08-04 |
| 9099479 | Carrier structures for microelectronic elements | Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2015-08-04 |
| 9070678 | Packaged semiconductor chips with array | Andrey Grinman, David Ovrutsky, Charles Rosenstein | 2015-06-30 |
| 9054013 | Method of making 3D integration microelectronic assembly for integrated circuit devices | — | 2015-06-09 |
| 9048234 | Off-chip vias in stacked chips | Belgacem Haba, Ilyas Mohammed, David Ovrutsky, Laura Wills Mirkarimi | 2015-06-02 |
| 9041133 | BSI image sensor package with embedded absorber for even reception of different wavelengths | Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2015-05-26 |
| 9018725 | Stepped package for image sensor and method of making same | — | 2015-04-28 |
| 9018769 | Non-lithographic formation of three-dimensional conductive elements | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2015-04-28 |
| 8999810 | Method of making a stacked microelectronic package | Belgacem Haba | 2015-04-07 |
| 8937361 | BSI image sensor package with variable-height silicon for even reception of different wavelengths | Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2015-01-20 |
| 8921759 | Integrated image sensor package with liquid crystal lens | — | 2014-12-30 |
| 8895344 | Method of making a low stress cavity package for back side illuminated image sensor | — | 2014-11-25 |
| 8847380 | Staged via formation from both sides of chip | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-09-30 |