Issued Patents All Time
Showing 101–125 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8610259 | Multi-function and shielded 3D interconnects | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2013-12-17 |
| 8604576 | Low stress cavity package for back side illuminated image sensor, and method of making same | — | 2013-12-10 |
| 8598695 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2013-12-03 |
| 8587126 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2013-11-19 |
| 8570669 | Multi-layer polymer lens and method of making same | — | 2013-10-29 |
| 8569876 | Packaged semiconductor chips with array | Andrey Grinman, David Ovrutsky, Charles Rosenstein | 2013-10-29 |
| 8552518 | 3D integrated microelectronic assembly with stress reducing interconnects | — | 2013-10-08 |
| 8546951 | 3D integration microelectronic assembly for integrated circuit devices | — | 2013-10-01 |
| 8546900 | 3D integration microelectronic assembly for integrated circuit devices | — | 2013-10-01 |
| 8513789 | Edge connect wafer level stacking with leads extending along edges | Belgacem Haba | 2013-08-20 |
| 8512491 | Dual wafer spin coating | Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2013-08-20 |
| 8502340 | High density three-dimensional integrated capacitors | Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2013-08-06 |
| 8486758 | Simultaneous wafer bonding and interconnect joining | Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2013-07-16 |
| 8476774 | Off-chip VIAS in stacked chips | Belgacem Haba, Ilyas Mohammed, David Ovrutsky, Laura Wills Mirkarimi | 2013-07-02 |
| 8461673 | Edge connect wafer level stacking | Belgacem Haba | 2013-06-11 |
| 8431435 | Edge connect wafer level stacking | Belgacem Haba | 2013-04-30 |
| 8432011 | Wire bond interposer package for CMOS image sensor and method of making same | — | 2013-04-30 |
| 8426957 | Edge connect wafer level stacking | Belgacem Haba | 2013-04-23 |
| 8405196 | Chips having rear contacts connected by through vias to front contacts | Belgacem Haba, Kenneth Honer, David B. Tuckerman | 2013-03-26 |
| 8310036 | Chips having rear contacts connected by through vias to front contacts | Belgacem Haba, Kenneth Honer, David B. Tuckerman | 2012-11-13 |
| 8115308 | Microelectronic assemblies having compliancy and methods therefor | Guilian Gao, Belgacem Haba, David Ovrutsky | 2012-02-14 |
| 8076788 | Off-chip vias in stacked chips | Belgacem Haba, Ilyas Mohammed, David Ovrutsky, Laura Wills Mirkarimi | 2011-12-13 |
| 8022527 | Edge connect wafer level stacking | Belgacem Haba | 2011-09-20 |
| 7935568 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | David Ovrutsky, Charles Rosenstein, Belgacem Haba, Giles Humpston | 2011-05-03 |
| 7936062 | Wafer level chip packaging | Giles Humpston, Michael J. Nystrom, Yulia Aksenton, Osher Avsian, Robert Burtzlaff +7 more | 2011-05-03 |