Issued Patents All Time
Showing 126–136 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7901989 | Reconstituted wafer level stacking | Belgacem Haba, Ilyas Mohammed, David Ovrutsky, Laura Wills Mirkarimi | 2011-03-08 |
| 7829438 | Edge connect wafer level stacking | Belgacem Haba | 2010-11-09 |
| 7807508 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Andrey Grinman, Charles Rosenstein, Felix Hazanovich, David Ovrutsky, Avi Dayan +2 more | 2010-10-05 |
| 7791199 | Packaged semiconductor chips | Andrey Grinman, David Ovrutsky, Charles Rosenstein, Belgacem Haba | 2010-09-07 |
| 7749886 | Microelectronic assemblies having compliancy and methods therefor | Guilian Gao, Belgacem Haba, David Ovrutsky | 2010-07-06 |
| 7642629 | Methods and apparatus for packaging integrated circuit devices | Gil Zilber, Reuven Katraro, Julia Aksenton | 2010-01-05 |
| 7495341 | Methods and apparatus for packaging integrated circuit devices | Gil Zilber, Julia Aksenton | 2009-02-24 |
| 7479398 | Methods and apparatus for packaging integrated circuit devices | Gil Zilber, Julia Aksenton | 2009-01-20 |
| 7265440 | Methods and apparatus for packaging integrated circuit devices | Gil Zilber, Reuven Katraro, Julia Aksenton | 2007-09-04 |
| 7192796 | Methods and apparatus for packaging integrated circuit devices | Gil Zilber, Julia Aksenton | 2007-03-20 |
| 6972480 | Methods and apparatus for packaging integrated circuit devices | Gil Zilber, Reuven Katraro, Julia Aksenton | 2005-12-06 |