Issued Patents All Time
Showing 76–100 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847376 | Microelectronic elements with post-assembly planarization | Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2014-09-30 |
| 8841763 | Three-dimensional system-in-a-package | Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2014-09-23 |
| 8835223 | Chip assembly having via interconnects joined by plating | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-09-16 |
| 8809190 | Multi-function and shielded 3D interconnects | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-08-19 |
| 8796828 | Compliant interconnects in wafers | Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2014-08-05 |
| 8796800 | Interposer package for CMOS image sensor and method of making same | — | 2014-08-05 |
| 8796135 | Microelectronic elements with rear contacts connected with via first or via middle structures | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-08-05 |
| 8791575 | Microelectronic elements having metallic pads overlying vias | Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2014-07-29 |
| 8759930 | Low profile image sensor package | — | 2014-06-24 |
| 8759973 | Microelectronic assemblies having compliancy and methods therefor | Guilian Gao, Belgacem Haba, David Ovrutsky | 2014-06-24 |
| 8753925 | Method of making 3D integration microelectronic assembly for integrated circuit devices | — | 2014-06-17 |
| 8742541 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh, Piyush Savalia | 2014-06-03 |
| 8736066 | Stacked microelectronic assemby with TSVS formed in stages and carrier above chip | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-05-27 |
| 8735205 | Chips having rear contacts connected by through vias to front contacts | Belgacem Haba, Kenneth Honer, David B. Tuckerman | 2014-05-27 |
| 8728934 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Ilyas Mohammed | 2014-05-20 |
| 8709913 | Simultaneous wafer bonding and interconnect joining | Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2014-04-29 |
| 8704347 | Packaged semiconductor chips | Andrey Grinman, David Ovrutsky, Charles Rosenstein, Belgacem Haba | 2014-04-22 |
| 8697569 | Non-lithographic formation of three-dimensional conductive elements | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-04-15 |
| 8692344 | Back side illuminated image sensor architecture, and method of making same | — | 2014-04-08 |
| 8686565 | Stacked chip assembly having vertical vias | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-04-01 |
| 8685793 | Chip assembly having via interconnects joined by plating | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2014-04-01 |
| 8653644 | Packaged semiconductor chips with array | Andrey Grinman, David Ovrutsky, Charles Rosenstein | 2014-02-18 |
| 8652935 | Void-free wafer bonding using channels | Ilyas Mohammed, Piyush Savalia, Craig Mitchell, Belgacem Haba | 2014-02-18 |
| 8637968 | Stacked microelectronic assembly having interposer connecting active chips | Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2014-01-28 |
| 8610264 | Compliant interconnects in wafers | Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2013-12-17 |