Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10739299 | Nanopore well structures and methods | Ronald L. Cicero, John Foster, Pirooz Parvarandeh, Marowen Ng, Wing Kei Au +1 more | 2020-08-11 |
| 8824142 | Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices | Nels Jewell-Larsen, Ron Goldman, Matthew K. Schwiebert | 2014-09-02 |
| 8804296 | System and method for in-situ conditioning of emitter electrode with silver | Guilian Gao, Matthew K. Schwiebert, Nels Jewell-Larsen | 2014-08-12 |
| 8735205 | Chips having rear contacts connected by through vias to front contacts | Belgacem Haba, David B. Tuckerman, Vage Oganesian | 2014-05-27 |
| 8508036 | Ultra-thin near-hermetic package based on rainier | Philip Damberg | 2013-08-13 |
| 8488294 | Ionic fluid flow accelerator | Matthew K. Schwiebert, Nels Jewell-Larsen | 2013-07-16 |
| 8466624 | Electrohydrodynamic fluid accelerator device with collector electrode exhibiting curved leading edge profile | Nels Jewell-Larsen, Matt Schwiebert, Hongyu Ran, Piyush Savalia, Yan Zhang | 2013-06-18 |
| 8467168 | Electronic system changeable to accommodate an EHD air mover or mechanical air mover | Yan Zhang | 2013-06-18 |
| 8411407 | Reversible flow electrohydrodynamic fluid accelerator | Nels Jewell-Larsen, Matt Schwiebert, Hongyu Ran, Piyush Savalia, Yan Zhang | 2013-04-02 |
| 8411435 | Electrohydrodynamic fluid accelerator with heat transfer surfaces operable as collector electrode | Nels Jewell-Larsen, Matt Schwiebert, Hongyu Ran, Piyush Savalia, Yan Zhang | 2013-04-02 |
| 8405951 | Cleaning mechanism with tandem movement over emitter and collector surfaces | Matthew K. Schwiebert, Nels Jewell-Larsen | 2013-03-26 |
| 8405196 | Chips having rear contacts connected by through vias to front contacts | Belgacem Haba, David B. Tuckerman, Vage Oganesian | 2013-03-26 |
| 8387531 | Impact sensing switch | Rolfe Tyson Gustus, Ilyas Mohammed | 2013-03-05 |
| 8310036 | Chips having rear contacts connected by through vias to front contacts | Belgacem Haba, David B. Tuckerman, Vage Oganesian | 2012-11-13 |
| 8280218 | Optical attenuator | Asif A. Godil, Matthew Lawrence, Eric K. Gustafson | 2012-10-02 |
| 8269319 | Collective and synergistic MRAM shields | Guilian Gao, William Walter Carlson, Michael Warner | 2012-09-18 |
| 8143095 | Sequential fabrication of vertical conductive interconnects in capped chips | — | 2012-03-27 |
| 8053281 | Method of forming a wafer level package | Belgacem Haba, David Ovrutsky, Charles Rosenstein, Guilian Gao | 2011-11-08 |
| 7858445 | Wire bonded wafer level cavity package | Giles Humpston, David B. Tuckerman, Michael J. Nystrom | 2010-12-28 |
| 7763983 | Stackable microelectronic device carriers, stacked device carriers and methods of making the same | Jae M. Park | 2010-07-27 |
| 7574096 | Optical attenuator | Asif A. Godil, Matthew Lawrence, Eric K. Gustafson | 2009-08-11 |
| 7566853 | Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture | David B. Tuckerman, Bruce M. McWilliams, Nicholas Colella, Charles Liam Goudge | 2009-07-28 |
| 7449779 | Wire bonded wafer level cavity package | Giles Humpston, David B. Tuckerman, Michael J. Nystrom | 2008-11-11 |
| 7356923 | Rigid flex interconnect via | — | 2008-04-15 |
| 6830990 | Method and apparatus for dicing released MEMS wafers | Aaron Parker, Daniel Parker | 2004-12-14 |