BM

Bruce M. McWilliams

EL Elwha: 4 patents #142 of 232Top 65%
TE Tessera: 4 patents #104 of 271Top 40%
TI The Invention Science Fund I: 4 patents #107 of 149Top 75%
NC Nchip: 1 patents #4 of 7Top 60%
Overall (All Time): #379,126 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10199793 Method and system for pumping of an optical resonator Jeffrey A. Bowers, William D. Duncan, Roderick A. Hyde, Jordin T. Kare, Nathan Kundtz +7 more 2019-02-05
9698558 Method and system for pumping of an optical resonator Jeffrey A. Bowers, William D. Duncan, Roderick A. Hyde, Jordin T. Kare, Nathan Kundtz +7 more 2017-07-04
9385503 Method and system for pumping of an optical resonator Jeffrey A. Bowers, William D. Duncan, Roderick A. Hyde, Jordin T. Kare, Nathan Kundtz +7 more 2016-07-05
9105978 Metamaterial surfaces Jeffrey A. Bowers, Roderick A. Hyde, Jordin T. Kare, Nathan Kundtz, John Brian Pendry +5 more 2015-08-11
9105979 Metamaterial surfaces Jeffrey A. Bowers, Roderick A. Hyde, Jordin T. Kare, Nathan Kundtz, John Brian Pendry +5 more 2015-08-11
9099786 Metamaterial surfaces Jeffrey A. Bowers, Roderick A. Hyde, Jordin T. Kare, Nathan Kundtz, John Brian Pendry +5 more 2015-08-04
9048621 Method and system for pumping of an optical resonator Jeffrey A. Bowers, William D. Duncan, Roderick A. Hyde, Jordin T. Kare, Nathan Kundtz +7 more 2015-06-02
8988759 Metamaterial surfaces Jeffrey A. Bowers, Roderick A. Hyde, Jordin T. Kare, Nathan Kundtz, John Brian Pendry +5 more 2015-03-24
7566853 Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture David B. Tuckerman, Kenneth Honer, Nicholas Colella, Charles Liam Goudge 2009-07-28
7298030 Structure and method of making sealed capped chips Giles Humpston, Belgacem Haba, David B. Tuckerman 2007-11-20
6891255 Microelectronic packages having an array of resilient leads John W. Smith 2005-05-10
6589819 Microelectronic packages having an array of resilient leads and methods therefor John W. Smith 2003-07-08
5214844 Method of assembling integrated circuits to a silicon board Nicholas Brathwaite, David B. Tuckerman 1993-06-01