Issued Patents All Time
Showing 1–25 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004930 | High density three-dimensional integrated capacitors | Vage Oganesian, Belgacem Haba, Ilyas Mohammed | 2021-05-11 |
| 10559494 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed | 2020-02-11 |
| 10354942 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2019-07-16 |
| 10262947 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba | 2019-04-16 |
| 10157978 | High density three-dimensional integrated capacitors | Vage Oganesian, Belgacem Haba, Ilyas Mohammed | 2018-12-18 |
| 9966303 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed | 2018-05-08 |
| 9859220 | Laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba | 2018-01-02 |
| 9847277 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2017-12-19 |
| 9659812 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed | 2017-05-23 |
| 9640437 | Methods of forming semiconductor elements using micro-abrasive particle stream | Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed | 2017-05-02 |
| 9620437 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2017-04-11 |
| 9560773 | Electrical barrier layers | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Craig Mitchell | 2017-01-31 |
| 9484333 | Multi-chip module with stacked face-down connected dies | Belgacem Haba, Ilyas Mohammed | 2016-11-01 |
| 9455181 | Vias in porous substrates | Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh | 2016-09-27 |
| 9437557 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh, Vage Oganesian | 2016-09-06 |
| 9431475 | High density three-dimensional integrated capacitors | Vage Oganesian, Belgacem Haba, Ilyas Mohammed | 2016-08-30 |
| 9368476 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2016-06-14 |
| 9362203 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2016-06-07 |
| 9355948 | Multi-function and shielded 3D interconnects | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2016-05-31 |
| 9355901 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2016-05-31 |
| 9355959 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba | 2016-05-31 |
| 9269692 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2016-02-23 |
| 9224649 | Compliant interconnects in wafers | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2015-12-29 |
| 9190463 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh, Vage Oganesian | 2015-11-17 |
| 9125333 | Electrical barrier layers | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Craig Mitchell | 2015-09-01 |